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Electronic component and package for device, and method of manufacturing the same

A technology of electronic components and manufacturing methods, which is applied in the manufacture of electrical components, battery pack parts, secondary batteries, etc., can solve the problems of reduced strength of joints, cumbersome manufacturing processes, a lot of time and manpower, and achieve high airtightness , high corrosion resistance effect

Inactive Publication Date: 2012-09-19
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] In addition, when such alloying occurs, there is a risk that the strength of the joint will be significantly reduced.
[0018] In addition, in order to join the ceramic base 110 and the cover 150, aluminum solders 125, 127, frame-shaped members 126, and base layer 128 are required, and the manufacturing process becomes complicated, requiring a lot of time and manpower, so there is a problem of low productivity.

Method used

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  • Electronic component and package for device, and method of manufacturing the same
  • Electronic component and package for device, and method of manufacturing the same
  • Electronic component and package for device, and method of manufacturing the same

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Embodiment Construction

[0045] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0046] figure 1 It is a figure for demonstrating the process of forming a metal layer on the surface of a ceramic base body in embodiment of this invention.

[0047] First, as a base, prepare figure 1 (A) shows a ceramic substrate 10 made of alumina having through holes 11a, 11b.

[0048] In addition, a metal containing aluminum as a main component of a desired composition is placed in a crucible (つぼ), and then the crucible is heated with a heater in a nitrogen atmosphere to melt the metal, thereby preparing for melting Metal. In the present embodiment, a metal containing 99% by weight of aluminum is used as the metal mainly composed of aluminum.

[0049] Next, the ceramic base 10 is dipped in the molten metal. As a result, the molten metal adheres to the surface of the ceramic base 10 . At this time, the molten metal also flows into and fills the through-holes 11...

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Abstract

Provided are an electronic component and a package for device which have high airtightness, wherein processes are made to be simple and productivity is improved in the manufacturing method thereof. The electronic component is provided with a device and a package storing the device. The package includes a ceramic base, a lid, and a connecting member connecting the ceramic base and the lid. A portion of the lid that joins with the connecting member is made of a metal. The connecting member is made of a metal mainly containing aluminum, and is directly joined to the ceramic base. The device is fixed to one of the ceramic base and the lid.

Description

technical field [0001] The present invention relates to packages for electronic components and elements having high airtightness, and their manufacturing methods. Background technique [0002] Conventionally, electronic components such as electric double-layer capacitors, batteries, and piezoelectric devices have been required to be further miniaturized and thinned along with miniaturization and thinning of electronic equipment. As such an electronic component, a surface mount type electronic component suitable for mounting on a circuit board or the like is often used. Surface-mount electronic components sometimes have a structure in which elements are accommodated in a package formed by bonding a metal lid to a base made of an insulating material such as ceramics with a connecting member. Disclosed in Patent Document 1 Figure 7 The structure of the battery as shown. [0003] Figure 7 The described battery 180 is constituted by an element, an element package for accommod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G9/155H01G4/224H01M2/02H01G11/78H01G11/80H01G11/84H01M50/103H01M50/117H01M50/119
CPCY02E60/12H01L41/08H01M10/0431H01M2/0287Y02E60/13H01M2/0217H01G11/78H01M2/0277H01G11/84H01M2/0285H01M2/0207H01G11/80Y10T29/4913H01L2924/16152H01L2924/16151Y02E60/10H01M50/103H01M50/124H01M50/117H01M50/119
Inventor 堀川景司
Owner MURATA MFG CO LTD