Distributed heat management device of communication machine room

Abstract

The invention discloses a distributed heat management device of a communication machine room. The device comprises an overhead floor, an air conditioning unit, an embedded heat pipe and an air return pipe, wherein an evaporation segment of the embedded heat pipe is mounted close to components generating large of heat inside a cabinet, and absorbs the heat which is then exported to the outside of the cabinet through a condensation segment; the air conditioning unit adopts downward air supply; and cold air absorbs heat exported by IT equipment and the heat pipe when flowing through the cabinet, then rises under air pressure and heat pressure, and returns to the air conditioning unit via an air return port to be cooled again; the far-end overhead floor is provided with a floor fan, thus ensuring effective heat dissipation of the IT equipment; and the starting of the floor fan is controlled through the backboard temperature of the IT equipment, and when a set temperature is exceeded, the floor fan is started. A recirculation fan adopts a frequency conversion technology, and adjusts rotation speed according to static pressure under the far-end fan, thus avoiding the impact resulting from lack of air in other cabinets when the floor fan is started. By adopting the distributed heat management device of the communication machine room, provided by the invention, the scheme of local and global temperature reduction of the communication machine room is further improved, and a worthy reference is provided for a communication machine room design.

Description

technical field [0001] The invention relates to the technical field of refrigeration devices, in particular to a distributed thermal management device for communication equipment rooms. Background technique [0002] With the development of communication technology, the degree of integration of electronic devices is getting higher and higher, the heat generated by equipment is increasing, and the requirements for temperature and humidity are gradually increasing. In view of the large heat generated by IT equipment in the computer room, the thermal environment of the equipment in the cabinet has a great impact on the life and operation reliability of electronic devices. Therefore, it is necessary to strictly control the local hot spots in the cabinet and the space temperature in the computer room to prevent overheating. Shutdown or burnout of electronic devices. When there are local hot spots in the data center equipment, the method of increasing the air supply volume and red...

AI Technical Summary

Problems solved by technology

Its structure and characteristics do not adopt the method of local hot spot control, which cannot ensure the safe and stable operation of equipment with large heat generation, and does not ensure the uniformity of temperature and airflow in the equipment room through reasonable airflow organization.

[0006] At present, most air-conditioning machine rooms adopt the overall cooling scheme of upper air supply, which cannot avoid the high heat density IT equipment's local temperature being too high, resulting in high heat generation and unstable operation of IT equipment.

At the same time, the directions of the upper air supply and the heat pressure are completely opposite. The cold air needs to overcome the wind pressure and blow it farther, and the lower air return of the computer room air conditioner makes the relatively cold air return to the evaporator, which loses part of the cooling capacity.

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