Organic EL device manufacture method

Abstract

The invention provides an organic EL device manufacture apparatus or deposition apparatus that can reduce affection of flexing of substrate and mask or warping of shadow mask, can reduce the generation of powder dust and gas in the vacuum by high precision deposition or configuring the drive part at the atmosphere side, and has high production character, high maintenance character and high work efficiency. Also provided is an alignment device and alignment method that can perform high precision positioning. The invention is characterized in that: firstly, the shadow mask is in contraposition to the substrate in a dependent pose to deposit the deposition material on the substrate; secondly, a permeation type using the light incident on the positioning through hole arranged on the shadow mask to perform positioning; and thirdly, the deposition is performed by reducing the warping of the shadow mask.

Description

[0001] This application was submitted on December 14, 2009, and the application number is 200910253190.7. It is an invention application titled "Organic EL device manufacturing device, film forming device and film forming method, liquid crystal display substrate manufacturing device, positioning device and positioning method" divisional application. technical field [0002] The present invention relates to an organic EL device manufacturing device, a film forming device and a film forming method thereof, a liquid crystal display substrate manufacturing device, a positioning device and a positioning method, and in particular to an organic EL device manufacturing device, a film forming device and a liquid crystal display device suitable for positioning a large substrate. Displays the substrate manufacturing equipment. Background technique [0003] As a powerful method for manufacturing an organic EL device, there is a vacuum evaporation method. The vacuum evaporation method r...

AI Technical Summary

Problems solved by technology

However, the reflective optical system has the following problems, and there is a problem that it cannot be positioned with good accuracy

(1) Since halo is caused by mirror finishing on the surface of the mask, the illumination intensity cannot be increased, and metal parts cannot be detected if it is lowered.

(2) In order not to damage the substrate surface during positioning, it is necessary to provide a gap of about 0.5mm between the mask and the reflective optical system, and the image becomes blurred due to the reduced depth of field

[0009] Secondly, in the method disclosed in Patent Document 1, since the entire mechanism for positioning the substrate and the mask is placed in a vacuum, dust and heat accompanying the movement of the drive unit or the like may be generated or may be emitted from the drive unit. The gas from the wiring, the gas from the lubricant, and the gas from the surface of the component reduce the vacuum degree

First, the dust that goes into the vacuum adheres to the substrate and the mask and causes poor deposition. Second, the thermal expansion of the mask caused by heat generation changes the deposition specifications. Third, the gas reduces the degree of vacuum. Therefore, there is a problem that the yield rate, that is, the productivity, decreases.

[0010] In addition, since the entire mechanism for positioning the substrate and the mask is installed in a vacuum, if a failure occurs in the drive unit, etc., it will take time to repair and the operating efficiency of the device will decrease.

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