Cyanide based electrolytic gold plating solution and plating method using same

A technology of cyanide alloy and conductive salt, which is applied in the field of cyanide-based electrolytic gold plating baths, can solve problems such as inability to perform cathodic current plating, and achieve the effects of excellent liquid stability, increased productivity, and shortened plating time

Inactive Publication Date: 2012-10-24
N E CHEMCAT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the gold concentration in the plating bath is lower than 5g/L, the cathode current density is between 0.1 and 0.5A

Method used

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  • Cyanide based electrolytic gold plating solution and plating method using same
  • Cyanide based electrolytic gold plating solution and plating method using same
  • Cyanide based electrolytic gold plating solution and plating method using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0091] Under the plating conditions shown in Table 2, gold plating films were respectively formed on the samples and the BGA panel using a plating bath having the following composition.

[0092]

[0093] The film thickness of the obtained gold-plated film was 0.70-0.75 micrometers, and it was a uniform semi-glossy shape. As shown in Table 2, the cathode current density is 0.05~0.4A / dm 2Within the range of the cathode current efficiency, film thickness deviation, lead pull test and solder ball shear test results are good.

[0094] (Table 2)

[0095]

Embodiment 2

[0103] Under the plating conditions shown in Table 4, gold plating films were respectively formed on the samples and the BGA panel using a plating bath having the following composition.

[0104]

[0105] The film thickness of the obtained gold-plated film was 0.70-0.75 micrometers, and it was a uniform semi-glossy shape. As shown in Table 4, the cathode current density is 0.05~0.4A / dm 2 Within the range of the cathode current efficiency, film thickness deviation, lead pull test and solder ball shear test results are good.

[0106] (Table 4)

[0107]

Embodiment 3

[0109] Under the plating conditions shown in Table 5, gold-plated films were formed on the samples and the BGA panel, respectively, using a plating bath having the following composition.

[0110]

[0111]

[0112] The film thickness of the obtained gold-plated film was 0.70-0.75 micrometers, and it was a uniform semi-glossy shape. As shown in Table 5, the cathode current density is 0.05~0.4A / dm 2 Within the range of the cathode current efficiency, film thickness deviation, lead pull test and solder ball shear test results are good.

[0113] (table 5)

[0114]

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Abstract

Disclosed is a cyanide based electrolytic gold plating solution characterized by containing a dicyanoaurate (I) alkali salt or dicyanoaurate (I) ammonium salt such that the gold concentration is 1.0 - 5.0 g/L, crystal adjuster, conductive salt, buffer and deposition accelerator formed from one of either a sulfite alkali salt and sulfite ammonium salt such that sulfite ions amount to 0.1 mg/L - 18 g/L.

Description

technical field [0001] The present invention relates to a cyanide-based electrolytic gold plating bath suitable for use when forming a gold-plated film on a printed wiring substrate such as a BGA (Ball Grid Array) wiring substrate, an IC package, a silicon or a compound wafer, and the like, and its use. plating method. Background technique [0002] Gold-plated films formed using cyanide-based electrolytic gold-plating baths are widely used in printed wiring boards, IC packages, LSI packages, LC driver ICs and other precision electronic equipment components. Gold plating films used in these precision electronic parts require high wire bonding properties, solderability, and heat resistance. The smoothness of the gold-plated film and the purity of the gold are important factors controlling these characteristics. In order to form a gold-plated film in which these characteristics are improved, crystal modifiers such as thallium and lead are used (Patent Documents 1-3). [0003...

Claims

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Application Information

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IPC IPC(8): C25D3/48C25D7/00H05K3/24
CPCC25D3/48H05K3/244
Inventor 中村宏
Owner N E CHEMCAT
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