Flexible organic light emitting diode (OLED) and preparation method thereof

A flexible and substrate technology, which is applied in the field of flexible OLED and its preparation, can solve the problems of heavy and fragile devices, and achieve the effects of good flexibility, long service life and high light transmittance

Active Publication Date: 2012-10-31
TRULY SEMICON
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Problems solved by technology

Today, almost all commercial OLED displays use glass as the substrate. After the production is completed, they are packaged with a glass back cover. The production process is generally: prepare the glass substrate, and then pre-clean the glass substrate. Deposit ITO lay

Method used

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Embodiment Construction

[0022] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail through specific examples below.

[0023] The basic idea of ​​the present invention is to provide a flexible OLED preparation method, using PET flakes as a substrate, and setting a barrier layer on the substrate. The barrier layer is formed by alternate deposition of polymer films and inorganic material films. The light transmittance of the PET substrate Nearly 90%, good flexibility, impact resistance, light weight, but high vapor transmission rate (English for water vapor transmission rate, referred to as WVTR) and oxygen transmission rate (English for oxygen transmission rate, referred to as OTR), respectively 10 -1 ~10g / m 2 / day and 10 -2 ~10 2 cm 3 / m 2 / day, resulting in a serious shortening of the life of the OLED device. In order to ensure a long service life of OLED (about 10000h), WVTR a...

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Abstract

The invention discloses a preparation method for a flexible organic light emitting diode (OLED), comprising the following steps: (1) a polyethylene terephthalate (PET) sheet is fixed at a support plate by binder as a base plate; the surface of the base plate is cleaned and dried; a barrier layer which is formed by successive alternating deposit of thin polymer films and thin inorganic material films with high transmittance is prepared on the base plate; the refractive index of the thin polymer films and the thin inorganic material films matches with the refractive index of the base plate; (2) an indium tin oxide (ITO) film and a metal layer are prepared at the base plate equipped with the barrier layer and etching of a metal line and an ITO line and making of polyimide (PI) patterns and RIB patterns are completed; during etching of the metal line and the ITO line, mechanical stirring or ultrasonic stirring are performed on the etching liquid; (3) then the base plate is put in an evaporation chamber for evaporation of an organic function layer and a negative electrode; (4) a thin film packaging layer is prepared on the surface of the negative electrode by vacuum evaporation and the packaging layer is formed by alternating deposit of at least one layer of organic material and at least one layer of inorganic material; and (5) the base plate is stripped off the support plate.

Description

technical field [0001] The invention relates to the technical field of OLED production, in particular to a flexible OLED and a preparation method thereof. Background technique [0002] OLED displays are used more and more widely. Today, almost all commercial OLED displays use glass as the substrate. After the production is completed, they are packaged with a glass back cover. The production process is generally: prepare the glass substrate, and then pre-clean the glass substrate. Deposit ITO layer and metal layer (such as Cu, Mo / Al / Mo, Cr, etc.) The organic functional layer and the cathode are then encapsulated with a glass back cover; the OLED obtained by this process not only makes the whole device heavy, but also easily broken under the action of external force. [0003] It can be seen that how to reduce the weight of the OLED and improve the anti-destructive ability of the OLED is a technical problem to be solved in this field. Contents of the invention [0004] In ...

Claims

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Application Information

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IPC IPC(8): H01L51/56H01L51/52H01L51/50
Inventor 何剑苏君海张色冯柯贤军张雪峰王勃何基强
Owner TRULY SEMICON
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