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89results about How to "Low oxygen transmission rate" patented technology

Transparent gas barrier film materials and production method thereof

ActiveCN104817710AMaintain oxygen tight performanceExtended Diffusion PathComposite filmOxygen
The invention discloses transparent gas barrier film materials and a production method thereof. A large length-diameter ratio of hydrotalcite nano-sheet serves as a precursor, the hydrotalcite whish is of a two-dimensional layered structure and various commercial packaging polymer raw materials are composited into a film by a simple suction filter deposition film forming technology, a diffusion path of gas molecules in the composite film can be significantly extended due to the large length-diameter ratio and the two-dimensional ordered structure of the hydrotalcite, and accordingly the barrier performance of the film materials is further improved. The finally produced transparent gas barrier film is ultra-low in oxygen transmissibility in comparison with a detection limit of an instrument and accordingly the problem that the requirement of the current barrier packaging field for the oxygen resistance performance of materials is high can be solved. According to the suction filter deposition film forming method, the production is simple, the raw material sources are wide, the material selection is convenient, the cost is low, and the environment-friendly and sustainable development requirements are met in comparison with the traditional method and accordingly the transparent gas barrier film materials comprise the potential application value in the fields of food, medicine packaging, electronic device packaging and the like.
Owner:BEIJING UNIV OF CHEM TECH

Polypropylene/polyvinylidene fluoride blended modified material and preparation method thereof

The invention discloses a polypropylene/polyvinylidene fluoride blended modified material and a preparation method thereof. The polypropylene/polyvinylidene fluoride blended modified material includes, by weight, 20-70 parts of polypropylene, 10-50 parts of polyvinylidene fluoride, 5-30 parts compatibilizer, 5-30 parts of a toughener, 0.05-1 part of an antioxidant and 0.05-5 parts of an ultraviolet absorber. The preparation method comprises the following steps: the polypropylene, polyvinylidene fluoride, the compatibilizer, the toughener, the antioxidant and the ultraviolet absorber are weighed according to the above formula ratio, and are added into a twin-screw extruder, and the obtained mixture is plasticized, is dispersed, and then undergoes extrusion granulation to obtain the polypropylene/polyvinylidene fluoride blended modified material. The ultraviolet radiation resistance quantity of the polypropylene/polyvinylidene fluoride modified material prepared in the invention can be increased by 3 times, or more, the outdoor service life of a tube made from the polypropylene/polyvinylidene fluoride modified material is prolonged to 2 times or more of the original service life, theoxygen permeability is reduced by 80%, and the polypropylene/polyvinylidene fluoride modified material also can be used in a -20 to 100 DEG C environment, so the application range is expanded.
Owner:嘉兴高正新材料科技股份有限公司

High-barrier biodegradable free-standing bag and preparation method thereof

The invention discloses a high-barrier biodegradable free-standing bag and a preparation method thereof. The free-standing bag is composed of two parts of a high-barrier biodegradable self-sealing strip and a five-layer composite high-barrier biodegradable bag body, the main substrate of the high-barrier biodegradable self-sealing strip is PLGA and PPC with excellent barrier property, the five-layer composite high-barrier biodegradable bag body is composed of single-light white kraft paper, a bonding layer, a first barrier layer, a second barrier layer and a heat seal layer, and is integrallyformed by adopting the four-layer co-extrusion and film-coating combined process. Compared with a traditional non-degradable free-standing bag, the prepared high-barrier biodegradable free-standing bag has the advantages that the physical mechanical property and the heat sealing performance are substantially equivalent, the barrier property is more excellent, biodegradation can be achieved, the problem of "white pollution" caused by waste of traditional free-standing bags is solved, and the application of the biodegradable plastic in the field of high-barrier food packaging is expanded, so that the high-barrier biodegradable free-standing bag has very important significance.
Owner:JIANGSU GOLDEN RAINBOW NEW MATERIAL CO LTD

Preparation method of chitosan composite preservative film

The invention discloses a preparation method of a chitosan composite preservative film. The preparation method comprises the following steps: dissolving chitosan in an acetic acid solution, heating to 50 to 65DEG C, and stirring until the chitosan is completely dissolved, so as to obtain a solution A; dispersing modified nano carbon crystal in the solution A, wherein the adding amount of the modified nano carbon crystal is 1 to 9 percent; then adding a plasticizer which accounts for 0.2 to 1 percent of the volume of the solution A, and carrying out stirring, ultrasonic dispersion, standing and ultrasonic degassing for 10 to 15 minutes to obtain a solution B; casting the solution B to form a film, standing and drying at the drying temperature of 35 to 55DEG C; then putting into 0.01 to 0.02mol/L of NaOH solution, soaking for 0.5 to 1 hour, flushing with distilled water, uncovering the film and drying in the sun to obtain the composite preservative film. The chitosan composite preservative film disclosed by the invention has relatively low water vapor permeability, so that excessive loss of water in fruits and vegetables is avoided; the chitosan composite preservative film has relatively good sterilizing function and strong antibacterial durability, i.e., an obvious sterilizing effect can be realized within one hour, and the antibacterial rates for escherichia coli and staphylococcus aureus after 48 hours still can reach 90 percent or above, so the preservation time of the fruits and the vegetables is prolonged.
Owner:ZHENGZHOU ARTIFICIAL DIAMOND & PROD ENG TECH RES CENT

Cooled meat fresh-keeping storage method and electrostatic field fresh-keeping device used for keeping fresh

The invention discloses a cooled meat fresh-keeping storage method and an electrostatic field fresh-keeping device for keeping fresh. The method comprises the following step of combining an electrostatic field fresh-keeping method and high-oxygen modified atmosphere packaging to carry out fresh-keeping storage on cooled meat, and further comprises the following steps: carrying out the high-oxygen modified atmosphere packaging on the cooled meat by adopting a high-barrier-property packaging material; and carrying out the fresh-keeping storage on the cooled meat subjected to the high-oxygen modified atmosphere packaging in a sealed low-temperature environment provided with the electrostatic field fresh-keeping device. The electrostatic field fresh-keeping device comprises a sealed box body or wall body and an electrostatic field generation device, wherein the electrostatic field generation device comprises an electrostatic field generation device body and electrodes; the electrodes are arranged in the sealed shell and are fixed on an inner wall of the sealed box body or wall body through an insulating material; the electrostatic field generation device body is arranged at the outer part of the sealed box body or wall body; the electrodes are electrically connected with the electrostatic field generation device body so that a space electrostatic field is formed in the sealed box body or wall body; and more than one electrode is arranged and the electrodes are distributed at different positions of the space in the sealed box body or wall body.
Owner:INST OF AGRO FOOD SCI & TECH CHINESE ACADEMY OF AGRI SCI +1

Chestnut shell extract-containing soy protein isolate-based film and preparation method thereof

The invention relates to a chestnut shell extract-containing soy protein isolate-based film and a preparation method thereof. The chestnut shell extract-containing soy protein isolate-based film solves the technical problem that the existing soy protein isolate-based film has low strength. The chestnut shell extract-containing soy protein isolate-based film is prepared from soy protein isolate powder, chestnut shell extract and glycerin. The preparation method comprises the following steps of dissolving the soy protein isolate powder in water to obtain a protein solution, dissolving the chestnut shell extract in water to obtain an extract solution, adding the extract solution and glycerin into the protein solution, carrying out homogenization emulsification to obtain a homogenate, adjusting a pH value of the homogenate, carrying out heating, carrying out cooling to obtain a film-forming solution, carrying out curtain coating on a substrate by the film-forming solution, and carrying out curing drying to obtain the chestnut shell extract-containing soy protein isolate-based film. The chestnut shell extract-containing soy protein isolate-based film has film tensile strength of 1.34-2.17MPa, breaking elongation of 185-217% and an oxygen permeation rate of 0.43-2.4cc/(m<2>. day) and can be used as a food package material.
Owner:NORTHEAST FORESTRY UNIVERSITY

Airtight high-thermal-conductivity LCP packaging substrate and multi-chip system-in-package structure

The invention discloses an airtight high-thermal-conductivity LCP packaging substrate and a multi-chip system-in-package structure. The LCP packaging substrate comprises n graphical metal circuit layers distributed from the surface to the bottom surface, wherein the n graphical metal circuit layer on the bottom surface is provided with a structure used for welding BGA solder balls; n-1 insulating dielectric layers which are positioned between the adjacent graphical metal circuit layers; a plurality of blind grooves which are positioned in the insulating medium layer between the first graphical metal circuit layer and the second graphical metal circuit layer, wherein openings of the blind grooves face the first graphical metal circuit layer on the surface, each blind grooves comprises acommon chip mounting blind groove and a high-power chip mounting blind groove; a metal block which is positioned in the insulating dielectric layer and is connected with the bottom of the high-powerchip mounting blind groove; and a plurality of blind holes which penetrate through and are connected with the adjacent graphical metal circuit layers. The LCP package substrate can meet the system-in-package requirements of multiple chips, high airtightness requirements, high electromagnetic shielding, high thermal conductivity requirements and high reliability interconnection.
Owner:SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP

Six-layer wiring LCP packaging substrate, manufacturing method and multi-chip system-in-package structure

The invention discloses a six-layer wiring LCP packaging substrate, a manufacturing method and a multi-chip system-in-package structure, and the LCP packaging substrate comprises six graphical metal circuit layers which are distributed from the surface to the bottom surface, wherein the graphical metal circuit layers sequentially comprises a first graphical metal circuit layer, a second graphicalmetal circuit layer, a third graphical metal circuit layer, a fourth graphical metal circuit layer, a fifth graphical metal circuit layer and a sixth graphical metal circuit layer; five insulating dielectric layers which are positioned between the adjacent graphical metal circuit layers; a plurality of blind grooves which are positioned in the insulating medium layer between the first graphical metal circuit layer and the second graphical metal circuit layer, wherein openings of the blind grooves face the first graphical metal circuit layer; and a plurality of blind holes which are positionedbetween the graphical metal circuit layer and the insulating dielectric layer. According to the LCP packaging substrate, the system-level packaging requirements of multiple chips, high airtightness requirements, high electromagnetic shielding and high reliability interconnection are met.
Owner:SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP

Tantalum alloy surface modified composite Hf-Ta coating layer and preparation method thereof

The invention discloses a tantalum alloy surface modified composite Hf-Ta coating layer. The tantalum alloy surface modified composite Hf-Ta coating layer consists of the following components in percentage by mass: 19.5-24.5% of Ta, 0.5-2.5% of Si, 0.5-1.2% of B, 0.5-2.5% of Al, 0.5-2.0% of Cr, and the balance being Hf. In addition, the invention further discloses a method for preparing the modified composite Hf-Ta coating layer; and the method comprises the following steps: (1) a tantalum alloy is washed by acid after being polished, and then is subjected to the sand blasting treatment and the degreasing treatment; (2) modified composite Hf-Ta slurry is prepared; and (3) the slurry is pre-positioned on the surface of the tantalum alloy to obtain a pre-positioned layer; and then, the high-temperature fusion sinteringis performed to prepare the modified composite Hf-Ta coating layer. The modified composite Hf-Ta coating layer can prominently improve the oxidation resistance of the tantalum alloy in environments of ultrahigh temperature and low oxygen pressure, and can provide short-time protection for the tantalum alloy in an ultrahigh-temperature oxidation environment and an ablation environment.
Owner:NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH

A kind of tantalum alloy surface modified composite HF-TA coating and preparation method thereof

The invention discloses a tantalum alloy surface modified composite Hf-Ta coating layer. The tantalum alloy surface modified composite Hf-Ta coating layer consists of the following components in percentage by mass: 19.5-24.5% of Ta, 0.5-2.5% of Si, 0.5-1.2% of B, 0.5-2.5% of Al, 0.5-2.0% of Cr, and the balance being Hf. In addition, the invention further discloses a method for preparing the modified composite Hf-Ta coating layer; and the method comprises the following steps: (1) a tantalum alloy is washed by acid after being polished, and then is subjected to the sand blasting treatment and the degreasing treatment; (2) modified composite Hf-Ta slurry is prepared; and (3) the slurry is pre-positioned on the surface of the tantalum alloy to obtain a pre-positioned layer; and then, the high-temperature fusion sinteringis performed to prepare the modified composite Hf-Ta coating layer. The modified composite Hf-Ta coating layer can prominently improve the oxidation resistance of the tantalum alloy in environments of ultrahigh temperature and low oxygen pressure, and can provide short-time protection for the tantalum alloy in an ultrahigh-temperature oxidation environment and an ablation environment.
Owner:NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH

A kind of flexible oled and preparation method thereof

The invention discloses a preparation method for a flexible organic light emitting diode (OLED), comprising the following steps: (1) a polyethylene terephthalate (PET) sheet is fixed at a support plate by binder as a base plate; the surface of the base plate is cleaned and dried; a barrier layer which is formed by successive alternating deposit of thin polymer films and thin inorganic material films with high transmittance is prepared on the base plate; the refractive index of the thin polymer films and the thin inorganic material films matches with the refractive index of the base plate; (2) an indium tin oxide (ITO) film and a metal layer are prepared at the base plate equipped with the barrier layer and etching of a metal line and an ITO line and making of polyimide (PI) patterns and RIB patterns are completed; during etching of the metal line and the ITO line, mechanical stirring or ultrasonic stirring are performed on the etching liquid; (3) then the base plate is put in an evaporation chamber for evaporation of an organic function layer and a negative electrode; (4) a thin film packaging layer is prepared on the surface of the negative electrode by vacuum evaporation and the packaging layer is formed by alternating deposit of at least one layer of organic material and at least one layer of inorganic material; and (5) the base plate is stripped off the support plate.
Owner:TRULY SEMICON

Six-layer wiring LCP packaging substrate, manufacturing method and multi-chip system-in-package structure

ActiveCN112349686ALow moisture absorption and water permeability and oxygen transmission rateHigh electromagnetic shieldingSemiconductor/solid-state device detailsSolid-state devicesEngineeringSystem in package
The invention discloses a six-layer wiring LCP packaging substrate, a manufacturing method and a multi-chip system-in-package structure, and the LCP packaging substrate comprises six graphical metal circuit layers which are distributed from the surface to the bottom surface, wherein the six graphical metal circuit layers sequentially comprises a first graphical metal circuit layer, a second graphical metal circuit layer, a third graphical metal circuit layer, a fourth graphical metal circuit layer, a fifth graphical metal circuit layer and a sixth graphical metal circuit layer; five insulatingdielectric layers which are positioned between the adjacent graphical metal circuit layers; a plurality of blind grooves which are positioned in the insulating medium layer between the first graphical metal circuit layer and the second graphical metal circuit layer, wherein openings of the blind grooves face the first graphical metal circuit layer; and a plurality of blind holes which are positioned between the graphical metal circuit layer and the insulating dielectric layer. The LCP packaging substrate of the airtight packaging structure can meet the system-level packaging requirements of multiple chips, high airtight requirements, high electromagnetic shielding and high reliable interconnection.
Owner:SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP

High-barrier PVA coating liquid and application thereof

The invention relates to the technical field of packaging materials, and in particular, relates to high-barrier PVA coating liquid and application thereof. Dried products of edible mushrooms are easy to absorb moisture and damp when stored in a humid environment, and decay and deteriorate under the action of oxygen, so that the edible value is lost, and a pure PE packaging bag is relatively good in moisture resistance, but relatively poor in oxygen barrier performance. Aiming at the technical problems, the invention provides the high-barrier PVA coating liquid, modified graphene is added into the components of the high-barrier PVA coating liquid, the modified graphene has high hydrophobicity, the high-barrier PVA coating liquid is coated on the surface of a PE packaging film, so that the water vapor transmission rate of a packaging bag can be effectively reduced, copper atoms are further loaded on the surface of a molecular structure of the modified graphene, the high reducibility is achieved, and oxygen in the external environment can be effectively prevented from entering the PE packaging bag; the high-barrier PVA coating liquid is also added with a plant extract with relatively strong oxidation resistance and a food deoxidant, so that the oxygen barrier performance of the packaging bag is effectively improved.
Owner:南通英韦尔新材料科技有限公司
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