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A kind of flexible colorless and transparent polyimide film and preparation method thereof

A technology of polyimide film and transparent polyimide, applied in the coating and other directions, can solve the problems of low oxygen and water vapor permeability and high thermal expansion coefficient of polyimide film, and achieve low thermal expansion coefficient and extended application. Field, effect of low oxygen transmission rate and water vapor transmission rate

Active Publication Date: 2021-02-26
长春聚明光电材料有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems of low oxygen and water vapor transmission rate and high thermal expansion coefficient of the prepared polyimide film existing in the existing preparation method, the present invention provides a flexible colorless and transparent polyimide film and its preparation method

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0046] Dissolve 8.778 grams of TFDB into 98 ml of DMF at room temperature, mechanically stir until TFDB is completely dissolved, add 7.306 grams of 6FDA and 3.226 grams of BPDA to the above solution under stirring, and stir for 12 hours to generate a polyamide with a solid content of 15 wt%. Acid glue, add 11.182g acetic anhydride and 5.591g triethylamine to polyamic acid glue solution, generate polyimide solution after stirring for 12 hours.

[0047] The formed polyimide solution was precipitated in ethanol and dried to obtain a polyimide resin. Take an appropriate amount of polyimide resin to prepare polyimide resin glue in DMAc. After vacuum degassing the polyimide resin glue, cast it on a clean glass plate, put it on a heating table and bake it at 80°C for 1 hour until the solvent evaporates, and after the film is cured, move the glass plate coated with the film into In the high-temperature oven, the oven is processed from room temperature to 250 °C at a heating rate of 5...

Embodiment 3

[0052] Dissolve 8.778 grams of TFDB into 98 ml of DMF at room temperature, mechanically stir until TFDB is completely dissolved, add 7.306 grams of 6FDA and 3.226 grams of BPDA to the above solution under stirring, and stir for 12 hours to generate a polyamic acid with a solid content of 15 wt%. Glue, add 11.182g of acetic anhydride and 5.591g of triethylamine to the polyamic acid glue solution, and stir for 12 hours to generate a polyimide solution.

[0053] The coating process is as in Example 1.

[0054] The buffer layer is prepared by magnetron sputtering (RF sputtering) on ​​SiO 2 , the preparation conditions were as in Example 2, the sputtering power was 1.5KW, and the thickness of the buffer layer was controlled to be about 140nm.

[0055] The oxygen transmission rate, water vapor transmission rate, light transmission rate and thermal expansion coefficient of the obtained film were tested, and the results are shown in Table 1.

[0056] Table 1

[0057] LT(...

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Abstract

A flexible colorless and transparent polyimide film and a preparation method thereof belong to the field of polyimide films, and solve the problems of low oxygen and water vapor permeability and high thermal expansion coefficient of the existing polyimide film. The invention includes: dissolving diamine and dianhydride in an organic solvent to generate polyamic acid glue, adding dehydrating agent and catalyst to complete chemical imidization reaction to generate polyimide glue, and precipitating and drying it in a solvent to obtain Polyimide resin, dissolve it in an organic solvent to obtain a polyimide resin glue, vacuum degassing it, coat it on a glass plate, heat it up and then cool it down to obtain a flexible, colorless and transparent polyimide The surface of the buffer layer is treated to form a layer of buffer layer; a layer of polyimide resin glue is coated on the surface of the buffer layer, and the temperature is increased after heating to obtain a flexible colorless transparent polyimide film with a composite structure. The present invention has low oxygen transmission rate, low water vapor transmission rate, low thermal expansion coefficient and high visible light transmission rate.

Description

technical field [0001] The invention belongs to the technical field of polyimide films, and in particular relates to a flexible, colorless and transparent polyimide film and a preparation method thereof. Background technique [0002] Polyimide film is a material with excellent thermal stability, mechanical properties, optical properties and low dielectric constant. It has been widely used in flexible printed circuit boards (FPC), electronic packaging, optical waveguide (Optical Waveguide), liquid crystal In the fields of alignment film of display (LCD) and microfluidic device (Microfluidic Device). In recent years, flexible colorless and transparent polyimide films have received high attention as display materials, touch module materials, solar cell materials, gas separation films, biosensor materials and flexible electronic materials. [0003] At present, the flexible colorless and transparent polyimide film prepared by the existing preparation process has high oxygen and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J7/04C08J7/048C08J7/06C08J5/18C08L79/08C08G73/10
CPCC08J5/18C08J2379/08C08J2479/08C08J7/0423C08J7/048C08J7/06C08G73/10C08G73/1014C08G73/1017Y02E10/549
Inventor 付饶许杨靳野张海洋赵丹东郭百灵
Owner 长春聚明光电材料有限公司
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