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Compound for packaging film, ink composition containing compound and packaging structure

A technology of ink composition and encapsulation film, which is applied in the compound, ink and application of elements of group 4/14 of the periodic table, and can solve the problems of limitation, fragility and poor toughness

Inactive Publication Date: 2021-07-30
JILIN OPTICAL & ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The material of the package cover is generally made of glass or metal, but the opacity of the metal cover limits its application in device packaging.
Although the glass cover package has no light transmittance problem, it has poor toughness and is fragile

Method used

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  • Compound for packaging film, ink composition containing compound and packaging structure
  • Compound for packaging film, ink composition containing compound and packaging structure
  • Compound for packaging film, ink composition containing compound and packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] A method for preparing an encapsulation structure, comprising the following steps:

[0040] Step S1: Treatment of organic layer materials

[0041] Compound (chemical formula 001), photocurable monomer (propylene glycol diacrylate), crosslinking initiator (2,4,6-trimethylbenzoyl-diphenylphosphine oxide) for encapsulation film;

[0042]

[0043]Weigh 20g of 001, 75g of propylene glycol diacrylate and 5g of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, mix them together, stir at 50°C under vacuum for 80h, and then use Filter with a syringe filter, use a particle counter to detect, and when the number of particles with a particle size greater than 0.5 μm is detected to be no more than 50, the organic layer material is obtained;

[0044] Step S2: Preparation of Inorganic Layer

[0045] Silicon nitride is selected as the inorganic layer material, and the inorganic layer material is coated on the surface of the object to be packaged by CVD to form an inorganic layer;

...

Embodiment 2

[0051] A method for preparing an encapsulation structure, comprising the following steps:

[0052] Step S1: Treatment of organic layer materials

[0053] Compound (chemical formula 002), photocurable monomer (trihydroxymethylpropanetriol triacrylate), crosslinking initiator (2,4,6-trimethylbenzoyldiphenylphosphine) for encapsulation film acid ester);

[0054]

[0055] Weigh 20g of 002, 75g of trihydroxymethylpropanetriol triacrylate and 5g of 2,4,6-trimethylbenzoyl diphenyl phosphinate, mix them together, and place them under vacuum at 50°C Stir for 80 hours, then filter with a syringe filter, use a particle counter to detect, when the number of particles with a particle size greater than 0.5 μm is detected to be no more than 50, the processed organic layer material is obtained;

[0056] Step S2: Preparation of Inorganic Layer

[0057] Silicon nitride is selected as the inorganic layer material, and the inorganic layer material is coated on the surface of the object to b...

Embodiment 3

[0063] A method for preparing an encapsulation structure, comprising the following steps:

[0064] Step S1: Treatment of organic layer materials

[0065] Compound (chemical formula 003), photocurable monomer (dipentaerythritol hexaacrylate), crosslinking initiator (2,4,6-trimethylbenzoyl diphenylphosphonite) for encapsulation film;

[0066]

[0067] Weigh 20g of 003, 75g of dipentaerythritol hexaacrylate and 5g of 2,4,6-trimethylbenzoyl diphenylphosphonite, mix them together, stir at 50°C for 80h under vacuum, and then Filter with a syringe filter, use a particle counter to detect, when the number of particles with a particle size greater than 0.5 μm is detected to be no more than 50, the organic layer material is obtained;

[0068] Step S2: Preparation of Inorganic Layer

[0069] Silicon nitride is selected as the inorganic layer material, and the inorganic layer material is coated on the surface of the object to be packaged by CVD to form an inorganic layer;

[0070] S...

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Abstract

The invention discloses a compound for packaging a film. The structural general formula of the compound for packaging the film is as follows: chemical formula 1. A curable silicon-containing monomer in the chemical formula 1 is used as a polymerization monomer. Due to a benzene ring and an epoxy group contained in the monomer, when the curable silicon-containing monomer is matched with a photocuring epoxy alkyl group-containing diluent monomer, a formed polymer film has higher light transmittance, higher curing speed and lower plasma etching rate, thereby better meeting the requirements of packaging films in the prior art.

Description

technical field [0001] The invention relates to the technical field of encapsulating films, and more specifically relates to a compound used for encapsulating films, an ink composition containing the same and an encapsulating structure. Background technique [0002] Organic Light-Emitting Diodes (OLEDs) have the characteristics of all solid state, active light emission, high brightness, high contrast, ultra-thin and ultra-light, low cost, low power consumption, no viewing angle limitation, wide operating temperature range, etc. , and can be fabricated on a flexible, lightweight, and durable plastic substrate, which can realize a truly flexible display, and is a technology that best meets people's requirements for future displays. [0003] For OLED devices, if the normal working life reaches more than 10,000 hours, the water vapor transmission rate (WVTR) of the device must be less than 10-6g / m 2 / day, oxygen permeability (OTR) is less than 10-5g / (m 2 · d), which is a great...

Claims

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Application Information

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IPC IPC(8): C07F7/18C09D11/38H01L51/52
CPCC07F7/1804C09D11/38H10K50/84
Inventor 于哲姜晓晨秦翠英崔明马晓宇王辉尹恩心
Owner JILIN OPTICAL & ELECTRONICS MATERIALS
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