Aluminum soldering paste
An aluminum brazing and soldering paste technology, applied in the field of aluminum soldering paste formula, can solve the problems of difficult solder application or fixing operation, inability to fix the solder, affecting production efficiency, etc., to improve product quality and production efficiency, simplify brazing Welding production process, the effect of reducing labor costs
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0015] 1) Aluminum-based alloy solder powder: accounts for 56% of the total weight of the solder paste. The alloy composition of aluminum-based solder powder is: Si: 12%, Cu: 0~30%, Zn: 0~8%, Mg: 0~ 1%, Sr: 0.02~0.1%, Al: balance.
[0016] 2) Potassium fluoroaluminate flux: 12% of the total weight of the solder paste.
[0017] 3) Tackifier: accounts for 3% of the total weight of the solder paste, of which hydrogenated rosin glyceride accounts for 60% of the total weight of the tackifier, and polymer EVA accounts for 40% of the total weight of the tackifier.
[0018] 4) Thickener: accounting for 8.95% of the total weight of the solder paste, of which cetearyl alcohol accounts for 60% of the total weight of the thickener, and methoxypolyethylene glycol accounts for 40% of the total weight of the thickener.
[0019] 5) Organic solvent: aliphatic hydrocarbon solvent D100, accounting for 20% of the total weight of the solder paste.
[0020] 6) Stabilizer: 0.05% of the total weigh...
Embodiment 2
[0022] 1) Aluminum-based alloy solder powder: accounts for 60% of the total weight of the solder paste. The alloy composition of aluminum-based solder powder is: Si: 5%, Cu: 20%, Zn: 5%, Mg: 0.8%, Sr: 0.1 %, Al: balance.
[0023] 2) Fluoroaluminate flux: accounting for 15% of the total weight of the solder paste, of which potassium fluoroaluminate accounts for 65% of the total weight of the flux, and cesium fluoroaluminate accounts for 35% of the total weight of the flux.
[0024] 3) Tackifier: ethylene-propylene copolymer, accounting for 6% of the total weight of the solder paste.
[0025] 4) Thickener: polyethylene n-butyl ether, accounting for 3.5% of the total weight of the solder paste.
[0026] 5) Organic solvent: accounts for 15% of the total weight of the solder paste, of which the aliphatic hydrocarbon solvent 120# solvent oil accounts for 60% of the total weight of the solvent, and the glycol derivative solvent ethylene glycol monoethyl ether accounts for 40% of the...
Embodiment 3
[0029] 1) Aluminum-based alloy solder powder: accounts for 65% of the total weight of the solder paste. The alloy composition of aluminum-based solder powder is: Si: 10%, Cu: 6%, Zn: 8%, Mg: 0.5%, Sr: 0.1 %, Al: balance.
[0030] 2) Fluoroaluminate flux: accounts for 12% of the total weight of the solder paste, including 80% potassium fluoaluminate flux and 20% cesium fluoaluminate flux.
[0031] 3) Tackifier: hydrogenated rosin glyceride accounts for 3% of the total weight of the solder paste.
[0032] 4) Thickener: Polymethacrylic acid accounts for 8.95% of the total weight of the solder paste.
[0033] 5) Organic solvent: aliphatic hydrocarbon solvent D100, accounting for 11% of the total weight of the solder paste.
[0034] 6) Stabilizer: 0.05% of the total weight of the solder paste, of which hydrogenated castor oil accounts for 55% of the total weight of the stabilizer, and triethanolamine accounts for 45% of the total weight of the stabilizer.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com