Adhesive composition, use thereof, connection structure for circuit members, and method for producing same
A technology for connecting structural bodies and circuit components, applied in printed circuit manufacturing, printed circuit components, thermoplastic polymer dielectrics, etc., can solve problems such as low heat resistance, adverse effects of organic substrates and peripheral components, and achieve excellent adhesion Excellent bonding strength, excellent connection reliability, and the effect of inhibiting dissolution
Active Publication Date: 2012-11-21
RESONAC CORPORATION
View PDF5 Cites 8 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] However, when semiconductor elements, liquid crystal display elements, and wiring are formed on low-heat-resistant organic substrates such as PET, PC, and PEN, defects in the organic substrate and peripheral parts due to heating during curing occur. Possibility of impact
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1~8 and comparative example 1~5
[0169] The solid mass ratio was blended as shown in Table 3, and conductive particles were blended and dispersed so that the total solid volume of the adhesive composition became 1.5% by volume, thereby obtaining an adhesive composition. The obtained adhesive composition was coated on a fluororesin film with a thickness of 80 μm using a coating device, and dried with hot air at 70° C. for 10 minutes to obtain a film-shaped adhesive with an adhesive layer having a thickness of 20 μm. combination.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| glass transition temperature | aaaaa | aaaaa |
| glass transition temperature | aaaaa | aaaaa |
| glass transition temperature | aaaaa | aaaaa |
Login to View More
Abstract
The invention provides an adhesive composition for connecting a first circuit member having a first connection terminal on the main surface, and a second circuit member having a second connection terminal on the main surface, wherein the first circuit member and / or the second circuit member are formed from a base material containing a thermoplastic resin having a glass transition temperature of 200 DEG C or less, the first connection terminal and / or the second connection terminal are formed from ITO and / or IZO, the adhesive composition contains a phosphoric acid-containing compound, and a cured product of the adhesive composition has a free phosphoric acid concentration of 100 mass ppm or less.
Description
technical field [0001] The present invention relates to an adhesive composition, its use, a circuit component connection structure, and its manufacturing method. Background technique [0002] In semiconductor elements and liquid crystal display elements, various adhesives have been conventionally used for the purpose of bonding various components in the elements. Requirements for adhesives are represented by adhesion, and involve various aspects such as heat resistance and reliability under high temperature and high humidity conditions. In addition, among the adherends used for bonding, organic substrates such as printed wiring boards and polyimides are typified, and SiN, SiO 2 Inorganic substrates such as copper and aluminum, metals such as copper and aluminum, substrates with various surface states such as ITO (composite oxide of indium and tin) and IZO (composite of indium oxide and zinc oxide). [0003] In addition, recently, semiconductor elements are formed on low he...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): C09J201/00C09J4/00C09J9/02C09J11/00H01B1/22H01B5/16H01L21/60H05K3/32
CPCH01L2924/09701H01L2224/83862H01L2224/13139H01L24/83H01L24/29H01L2224/13164H01L2224/9211C08K5/49H01L2224/32225H01L2224/83101H05K3/323H01L2224/13144H01L2224/16C09J11/06H01L2924/07811C08F230/02H01L2924/01046H01L2924/01004C09D4/06H01L2224/81903H05K2201/10977C09J175/06H01L24/16H01L2924/01079H01L2224/13155H01L2224/83192H01L24/13H01L2224/73204H05K1/141H01L2224/13147H01L2224/2919H05K2201/0129H01L2224/83851C09J171/08H01L2224/81193H05K1/0313C09J9/02H01L2224/13124H05K1/09H01L2924/01019H01L24/32H01L2924/01077H01L2224/16238H01L2224/16225C08K5/521H01B1/22H01L2924/0102H01L24/81H01L2924/15788H01L2924/00H01L2924/00014H01L2924/00012H01L2224/81H01L2224/83C09J201/00H05K3/32
Inventor 伊泽弘行加藤木茂树
Owner RESONAC CORPORATION