Method for manufacturing high-silicon steel sheet containing novel composite inhibitors
A composite inhibitor and high-silicon steel technology is applied in the field of metal material preparation to achieve the effects of excellent surface quality, good application prospects and universal applicability
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Embodiment 1
[0012] The chemical composition (wt%) of high silicon steel is: Si: 4.5, Nb: 0.1; B: 0.1, Mn: 0.01, S: 0.012, P: 0.015, C: 0.020, Al: 0.003, the rest is Fe and unavoidable inclusions. The high silicon steel hot-rolled plate with a thickness of 3.0mm is heat-treated, kept at 1200°C for 3 hours, oil-cooled; warm-rolled, the rolling temperature is 750°C, the final rolling temperature is 250°C, and a 0.6mm plate is obtained. The warm-rolled sheet was heat-treated at 500° C. for 5 minutes, cooled with salt water, and then cold-rolled to obtain a high-silicon steel cold-rolled sheet with a thickness of 0.6 mm.
Embodiment 2
[0014] The chemical composition (wt%) of high silicon steel is: Si: 6.5, Nb: 0.3; B: 0.2, Mn: 0.01, S: 0.01, P: 0.01, C: 0.02, Al: 0.001, the rest is Fe and unavoidable inclusions. Carry out heat treatment on the high-silicon steel hot-rolled plate with a thickness of 2.0mm, keep it at 1000°C for 2 hours, and cool it in salt water; warm rolling, the starting temperature is 700°C, and the final rolling temperature is 300°C to obtain a 0.2mm thick plate, and the warm-rolled plate is subjected to 30 minutes , heat treatment at 800°C, water cooling, and then cold rolling to obtain a high-silicon cold-rolled sheet with a thickness of 0.05mm.
Embodiment 3
[0016] The chemical composition (wt%) of high silicon steel is: Si: 7.0, Nb: 0.15; B: 0.3, Mn: 0.02, S: 0.01, P: 0.02, C: 0.04, Al: 0.001, the rest is Fe and unavoidable inclusions. Carry out heat treatment on the high-silicon steel hot-rolled plate with a thickness of 4.0mm, keep it at 900°C for 0.5 hours, and water-cool; ℃ heat treatment, salt water cooling, and then cold rolling to a high-silicon cold-rolled sheet with a thickness of 0.3mm.
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