Micro-crack flat heat pipe and manufacturing method thereof

A technology of a flat heat pipe and a manufacturing method, applied in the field of electronics, can solve the problem of insufficient heat dissipation capability of the heat pipe, and achieve the effects of simple and easy technical means, improved heat transfer, and low backflow resistance.
CN102829659AActive Publication Date: 2012-12-19SOUTH CHINA UNIV OF TECH
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
SOUTH CHINA UNIV OF TECH
Publication Date
2012-12-19

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Abstract

The invention discloses a micro-crack flat heat pipe and a manufacturing method thereof. The micro-crack flat heat pipe comprises a pipe body and a porous capillary layer attached to an inner wall of the pipe body, wherein a plurality of slots are arranged on the surface of the porous capillary layer and are uniformly distributed along the circumference of the inner wall of the pipe body. The manufacturing method comprises the following steps: placing a sintered core bar on the middle part in the pipe body and arranging a clearance between the pipe body and the sintered core bar; contracting the tail at one end of the pipe body and then performing de-rusting and de-oiling treatment on the pipe body and the sintered core bar; filling metal powder into the clearance between the pipe body and the sintered core bar and placing the metal powder together with the pipe body into a high-temperature sintering furnace for sintering; after sintering, taking out the pipe body, cooling to room temperature and then taking out the sintered core bar; vacuumizing, filling a working medium and sealing at the other end of the pipe body; and flattening and shaping the pipe body. A phase-change flattening technology is adopted by the invention; a continuous and big enough porous capillary layer, namely, a micro-crack channel space, is obtained according to a sintered core bar inducing method; a steam channel is supplied; and the heat transfer and mass transfer properties of the flat heat pipe are obviously increased.
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Description

technical field

[0001] The invention relates to heat dissipation components in the electronic field, in particular to a micro-crack flat heat pipe and a manufacturing method thereof. Background technique

[0002] With the rapid development of high-performance electronic chip technology and the continuous improvement of electronic packaging and integration, the heat flux density of the chip will increase sharply and the effective heat dissipation space will become increasingly narrow. The traditional heat dissipation methods can no longer meet the heat dissipation requirements. The cooling system is developed and optimized. Because the flat heat pipe has the characteristics of fast heat transfer and small space occupation, it is widely used in electronic products in these small spaces.

[0003] Traditional micro heat pipes with liquid-absorbent cores mainly include grooved heat pipes, sintered metal powder heat pipes, wire mesh heat pipes, and fiber-type liquid-absorbent cor...

Claims

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