Thin film forming method and thin film forming apparatus
A technology of thin film and thin film material, which is applied in the field of thin film formation and thin film formation device, which can solve the problems of reduced throughput of the device and longer idle time of nozzles, etc.
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Embodiment 1
[0047] figure 1 A schematic diagram of a thin film forming apparatus according to Example 1 is shown in . The thin film forming apparatus based on Example 1 is divided into: a loading station 21, a first alignment station 22, a first film material discharge station 23, a substrate inversion station 24, a second alignment station 25, and a second film material discharge station 26 and move out of station 27. Each station is accommodated in the housing 20 .
[0048] The linear guide 30 and the four lifters 31 to 34 supported by the linear guide 30 constitute a conveying device. The transport device transports the substrate 40 from the previous station to the subsequent station. The substrate 40 is, for example, a printed wiring board in which wiring patterns are formed on both surfaces. The control device 50 moves the elevators 31 to 34 and controls each station. An xyz rectangular coordinate system is defined in which the conveyance direction of the substrate 40 is defined a...
Embodiment 2
[0087] Figure 8 A plan view of the first thin film material discharge station of the thin film forming apparatus according to Example 2 is shown in . Differences from Embodiment 1 will be described below, and description of the same configuration will be omitted. Local curing light source 73 ( Figure 5A ) is installed on the lifter 32 , but the light source 90 for local curing is installed on the supporting member 58 in the second embodiment. That is, the local curing light source 90 is disposed above the stage 55 and faces the substrate 40 . When the substrate 40 is moved in the y direction, the position of the local curing light source 90 in the x direction is adjusted so that the spacer contact region 82 defined on the surface of the substrate 40 passes through the ultraviolet rays radiated from the local curing light source 90. within the path.
[0088] Next, refer to Figure 9A ~ Figure 9D , the method of actually curing the thin film in the pad contact region 82 w...
Embodiment 3
[0094] refer to Figure 10A and Figure 10B , the thin film forming apparatus and thin film forming method based on Example 3 will be described. Hereinafter, differences from Embodiment 1 will be described, and descriptions of the same configurations will be omitted.
[0095] Figure 10AA plan view of a substrate to be formed into a thin film and a formed thin film pattern by the method based on Example 3 is shown in . In Example 1, the thin film is formed over substantially the entire surface of the substrate 40 . In the third embodiment, the substrate 40 is divided into a plurality of printed wiring regions 41 , and the thin film is formed inside the printed wiring regions 41 . No thin film is formed in regions other than the printed wiring region 41 . The plurality of printed wiring regions 41 are arranged, for example, in a matrix shape in which the x direction is the row direction and the y direction is the column direction. Between the two printed wiring regions 41...
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