Epoxy conductive silver adhesive with imidazole nickel salt serving as accelerant and preparation method of epoxy conductive silver adhesive
A technology of conductive silver glue and accelerator, which is applied in the direction of epoxy resin glue, conductive adhesive, adhesive, etc., can solve the problem of inability to store, unsatisfactory storage period, and rare reports of single-component epoxy conductive glue, etc. problem, to achieve the effect of excellent electrical performance
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Embodiment 1
[0021] Described a kind of epoxy conductive silver glue with imidazole nickel salt as promotor is prepared according to the following mass ratio:
[0022]
[0023] Mix 100 parts of bisphenol A epoxy resin E-54 and 25 parts of phenyl glycidyl ether in a mass ratio, grind and stir evenly; add 5 parts of dicyandiamide and 0.2 parts of imidazole nickel salt and grind and stir for 10 minutes to obtain Resin matrix; then add 390 parts of flaky silver powder to the resin matrix in 3 times, grind and stir for more than 30 minutes to obtain epoxy conductive adhesive.
[0024] After the prepared conductive adhesive is cured at 150°C for 30 minutes, the volume resistivity is 9×10 -4 Ω·㎝, the shear strength is 10.2MPa, and the performance of the product does not change much after being stored at room temperature for 3 months.
Embodiment 2
[0026] Described a kind of epoxy conductive silver glue with imidazole nickel salt as promotor is prepared according to the following mass ratio:
[0027]
[0028] Mix 100 parts of bisphenol A epoxy resin E-54 and 25 parts of phenyl glycidyl ether in a mass ratio, grind and stir evenly; add 7 parts of dicyandiamide and 0.2 parts of imidazole nickel salt and grind and stir for 10 minutes to obtain Resin matrix; then add 390 parts of flaky silver powder to the resin matrix in 3 times, grind and stir for more than 30 minutes to obtain epoxy conductive adhesive.
[0029] After the prepared conductive adhesive is cured at 150°C for 30 minutes, the volume resistivity is 10.6×10 -4 Ω·cm, the shear strength is 12.1MPa, and the performance of the product does not change much after being stored at room temperature for 3 months.
Embodiment 3
[0031] Described a kind of epoxy conductive silver glue with imidazole nickel salt as promotor is prepared according to the following mass ratio:
[0032]
[0033] Mix 50 parts of bisphenol A epoxy resin E-54, 50 parts of bisphenol F epoxy resin, and 25 parts of phenyl glycidyl ether, grind and stir evenly; add 5 parts of dicyandiamide, 0.2 1 part of imidazole nickel salt was ground and stirred for 10 minutes to obtain a resin matrix; then 390 parts of flaky silver powder were added to the resin matrix in 3 times, and ground and stirred for more than 30 minutes to obtain an epoxy conductive adhesive. 4
[0034] After the prepared conductive adhesive was cured at 150°C for 30 minutes, the volume resistivity was 8.9×10 -4 Ω·㎝, the shear strength is 9.6MPa, and the performance of the product does not change much after being stored at room temperature for 3 months.
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