Preparation method of thick paperboard with high bonding strength between paperboards

A technology of interlayer bonding strength and thick cardboard, used in paper, papermaking, textiles and papermaking, etc., can solve the problems of easy pulping, poor dewatering of formed wet paper sheets, easy delamination, etc., to improve retention rate, improve Bond strength, the effect of increasing bond points and bond forces

Active Publication Date: 2013-01-16
JIANGXI JIEMEI ELECTRONICS INFORMATION MATERIAL CO LTD
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AI Technical Summary

Problems solved by technology

[0002] Existing thick cardboard is generally made of pulp with high beating degree, but because the pulp with high beating degree is difficult to filter water in the papermaking wire, the dehydration of the formed wet paper is poor, and it is easy to lose pulp, foam and wrinkles when producing thick cardboard. Paper defects, and more power consumption is required to increase the beating degree, and although the pulp with low beating degree is better in water filtration, due to the poor separation of pulp fibers and poor interweaving force between fibers, the interlayer of the paperboard made Poor bonding strength, easy to delaminate

Method used

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  • Preparation method of thick paperboard with high bonding strength between paperboards

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Embodiment Construction

[0016] The specific implementation manner of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0017] Such as figure 1 The preparation method of the cardboard of a kind of high cardboard interlayer bonding strength shown, this method utilizes beating degree to be 20 o SR~35 oSR After the pulp is formed on the Internet to form wet paper sheets, spray the mist adhesive aqueous solution between the wet paper layers, such as spraying the mist adhesive solution after the wet paper sheets are formed on the No. Aqueous mixture solution, the aqueous binder solution is one of starch, modified polyacrylamide or a mixture thereof, and the concentration of the aqueous binder solution is 0.5% to 6.0%. Then enter the return roller, the main pressure roller, and the press roller to be bonded together, and then dry the first part of the dryer for surface treatment, then enter the second part of the dryer for drying, pass through the ca...

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Abstract

The invention relates to a preparation method of a thick paperboard, in particular to a preparation method of a thick paperboard with high bonding strength between paperboards. In the preparation method, a fog-like adhesive water solution is sprayed between wet paper layers before the wet paper formed on a net by pulp with beating degree of 20-35oSR are mutually bonded; the adhesive water solution is one of starch, polyacrylamide modified substance or a mixture of starch and the polyacrylamide modified substance; and the concentration of the adhesive water solution is 0.5-6.0%. The preparation method has following advantages that: 1, manufacturing paper with pulp is easy, and energy can be saved; and 2, the effect of improving bonding strength is notable, and a certain effect in improving retention of the pulp and chemical materials is realized. In addition, the preparation method increases bonding point and bonding force between the adhesive and pulp fibers so as to greatly improve bonding strength between the paperboards.

Description

technical field [0001] The invention relates to a method for preparing thick cardboard. Background technique [0002] Existing thick cardboard is generally made of pulp with high beating degree, but because the pulp with high beating degree is difficult to filter water in the papermaking wire, the dehydration of the formed wet paper is poor, and it is easy to lose pulp, foam and wrinkles when producing thick cardboard. Paper defects, and more power consumption is required to increase the beating degree, and although the pulp with low beating degree is better in water filtration, due to the poor separation of pulp fibers and poor interweaving force between fibers, the interlayer of the paperboard made Poor bonding strength, easy to delaminate. Contents of the invention [0003] In order to solve the above-mentioned technical problems, the object of the present invention is to provide a method for preparing thick cardboard with high bonding strength between cardboard layers...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): D21H17/28D21H17/55
Inventor 姜兆宏
Owner JIANGXI JIEMEI ELECTRONICS INFORMATION MATERIAL CO LTD
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