High-power LED (light-emitting diode) lamp module of chip-on-board

An LED lamp and high-power technology, which is applied in the parts of lighting devices, cooling/heating devices of lighting devices, lighting and heating equipment, etc., can solve the problems of high heat generation, low light efficiency, light consumption, etc. Efficiency, improved lighting brightness, reduced usage effects

Active Publication Date: 2013-01-16
浙江中博光电科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0014] (2) In existing LED lamps, each LED chip will reflect and block each other, which

Method used

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  • High-power LED (light-emitting diode) lamp module of chip-on-board
  • High-power LED (light-emitting diode) lamp module of chip-on-board
  • High-power LED (light-emitting diode) lamp module of chip-on-board

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Experimental program
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Example Embodiment

[0050] Combine below Figure 2 to Figure 9 , To further explain the present invention:

[0051] Such as figure 2 As shown, the "chip-on-board" in the high-power LED lamp module of the chip-on-board refers to directly encapsulating the chip on the uniform temperature board, and its specific structure is as follows:

[0052] Attach the capillary tissue 12 to the inner wall of the uniform temperature plate 1, and seal the uniform temperature plate of the support 11, and leave an injection port 13. Coat the surface of the uniform temperature plate 1 with a high thermal conductivity insulating medium to form An insulating dielectric layer 32.

[0053] Then, a circuit layer 31 is formed on the insulating dielectric layer 32, and the first stage of the manufacturing process is completed through the process of die bonding, gold wire, upper reflector bracket 43, adding phosphor 41 (only required for white light source).

[0054] After completing the above process, add working fluid to the in...

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Abstract

The invention relates to a high-power LED (light-emitting diode) lamp module of a chip-on-board. The lamp module comprises an LED light emitting unit, a uniform temperature plate (1) and a heat radiating structure (2), wherein the LED light emitting unit is fixed on the uniform temperature plate (1), the heat radiating structure (2) is fixed below the uniform temperature plate (1); and the lamp module is characterized in that the heat radiating structure (2) and the uniform temperature plate (1) transfer heat by a graphite paste (8). In the high-power LED lamp module, the graphite paste arranged between the heat radiating structure and the uniform temperature plate has excellent heat transfer performance; and compared with a structure in the prior art, the high-power LED lamp module has the advantages that a layer of heat conducting silica gel is omitted, and the heat radiating efficiency is greatly increased.

Description

technical field [0001] The invention relates to an LED lamp, in particular to a chip-on-board high-power LED lamp module. Background technique [0002] With the continuous improvement of the luminous efficiency of LED light-emitting chips, it is just around the corner that LED lighting will replace traditional lighting. In addition to the luminous efficiency of the LED chip itself, the luminous efficiency of the lamp is also critical to the packaging process and the design of the optics, mechanism, drive power, and heat dissipation of the lamp. [0003] The optical design lies in the design of the light distribution of the light source of the lamp according to the needs of the user. In addition, the light transmission and reflection design of the lens and reflector is related to the light effect of the lamp. The conversion efficiency of the driving power is high, which means that the power consumption is low, and the light efficiency will naturally be improved. A good heat...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V29/00F21V31/00F21V13/04H01L33/64F21Y101/02F21V29/74F21V29/83
CPCH01L2224/48091
Inventor 谈彪赵权
Owner 浙江中博光电科技有限公司
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