Through Hole Processing Method
A processing method and positioning hole technology, which are applied in metal processing, metal processing equipment, manufacturing tools, etc., can solve the problems that no high-frequency metal substrate through-hole drilling method has been proposed, and achieve the improvement of hole wall nodules and reduce the space between holes. Obvious effects on wear and hole wall nodules
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no. 1 example
[0043] Specifically, image 3 A flow chart of a through hole processing method according to an embodiment of the present invention is schematically shown.
[0044] Such as image 3 As shown, the through hole processing method according to the embodiment of the present invention includes:
[0045] The first step S1: PTFE surface drilling positioning
[0046] Wherein, drilling and positioning are performed on the high-frequency material surface (the PTFE surface in this embodiment) of the pre-bonded high-frequency metal substrate. Among them, the pre-bonded high-frequency metal substrate refers to: bonding high-frequency materials and metal substrates (for example, copper-based, aluminum-based) together (for example, after high-temperature bonding) by a certain pressing method to form a pre-bonded Bond high-frequency metal substrates.
[0047] More specifically, in the first step S1, a positioning hole 4 is respectively formed on the four corners of the pre-bonded high-frequ...
no. 2 example
[0063] Although the first embodiment describes the case where the high-frequency material side is drilled first, and then the metallic material is drilled (that is, the image 3 The first step S1, the second step S2, the third step S3, and the fourth step S4 of the flow chart of the through hole processing method shown), however, it is obvious that the present invention is also applicable to drilling the metal material side first hole, and then drill the high-frequency material side.
[0064] That is, for image 3 In the flow chart of the through-hole processing method shown, the third step S3, the fourth step S4, the first step S1 and the second step S2 may be executed sequentially.
[0065] Thus, for example, the through-hole processing method according to the second embodiment of the present invention includes steps performed in sequence:
[0066] The metal material surface positioning step is used to make multiple positioning holes on the pre-bonded high-frequency metal ...
no. 3 example
[0071] Although the first embodiment describes the case where one positioning hole 4 is respectively formed on the four corners of the pre-bonded high-frequency metal substrate, in other embodiments, multiple positioning holes 4 may be formed on the pre-bonded high-frequency metal substrate. holes, as long as the pre-bonded high-frequency metal substrate can be fixed to the backing plate 7 through the plurality of positioning holes.
[0072] For example, a positioning hole may be formed on three of the four corners of the pre-bonded high-frequency metal substrate, or a positioning hole may be formed on two opposite corners of the four corners of the pre-bonded high-frequency metal substrate, Of course, positioning holes can also be formed at other positions of the pre-bonded high-frequency metal substrate, as long as the pre-bonded high-frequency metal substrate can be fixed to the backing plate 7 through the plurality of positioning holes.
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Abstract
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