Pre-aligning device for photoetching device

A lithography equipment and pre-alignment technology, which is applied in the field of integrated circuit manufacturing equipment, can solve the problem of high precision and stability of silicon wafer temperature, does not involve precise measurement of silicon wafer stable temperature, cannot know whether the silicon wafer temperature is up to standard, etc. problem, to achieve the effect of improving peace of mind

Active Publication Date: 2014-11-12
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

The main disadvantage of this technical solution is that it is difficult to achieve high-precision stabilization of the temperature of the silicon wafer, and this technical solution does not involve precise measurement of the stable temperature of the silicon wafer. During use, it is impossible to know exactly whether the temperature of the silicon wafer reaches the standard

Method used

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  • Pre-aligning device for photoetching device
  • Pre-aligning device for photoetching device
  • Pre-aligning device for photoetching device

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Embodiment Construction

[0040] A pre-alignment device according to a specific embodiment of the present invention will be described in detail below with reference to the accompanying drawings. However, the present invention should be understood as not limited to such embodiments described below, and the technical idea of ​​the present invention can be implemented in combination with other known technologies or other technologies having the same functions as those known technologies.

[0041] In the following description, in order to clearly show the structure and working method of the present invention, many directional words will be used to describe, but "front", "rear", "left", "right", "outer", "inner" should be used Words such as ", "outward", "inward", "upper" and "lower" are to be understood as convenient terms, and should not be understood as restrictive terms. In addition, the term "X direction" used in the following description mainly refers to the direction parallel to the horizontal direct...

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Abstract

The invention discloses a pre-aligning device for a photoetching device for pre-alignment of a silicon wafer in transmission. The pre-aligning device comprises a temperature stabilizing unit, a differential leveling unit for supporting the temperature stabilizing unit, a directional sucking disc unit and a first motion mechanism for driving the directional sucking disc to move, a centering sucking disc unit and a second motion mechanism for driving the centering sucking disc unit to move. An inner hole for the directional sucking disc unit and the centering sucking disc unit to pass through is arranged through the center of the temperature stabilizing unit. The directional sucking disc unit is located at the center of the temperature stabilizing unit. The centering sucking disc unit is located between the temperature stabilizing unit and the directional sucking disc unit.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing equipment, in particular to a pre-alignment device used in photolithography equipment with the function of stabilizing the temperature of silicon wafers. Background technique [0002] Lithographic equipment is a kind of equipment applied to the manufacture of integrated circuits, which may include but not limited to: integrated circuit manufacturing lithography equipment, liquid crystal panel lithography equipment, photomask marking equipment, MEMS (micro-electromechanical systems) / MOMS (micro-optical machine system) lithography equipment, advanced packaging lithography equipment, printed circuit board lithography equipment and printed circuit board processing equipment, etc. [0003] In high-end lithography equipment, silicon wafers need to be transferred from a cassette to a predetermined position on a workpiece table. During the transmission process, the silicon wafer must be ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F9/00G03F7/20H01L21/68H01L21/00
Inventor 胡松立姜杰
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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