A Microetching Process Method for Suppressing Microdischarge Effect of Microwave Components

Abstract

The invention discloses a microetch process for restraining a micro-discharge effect of a microwave part. The core of the method is that a silver coating surface of an aluminium alloy is subjected to microetch through a chemical method on the basis that good electrical conductivity of the microwave part is guaranteed, a nano micro trap structure is formed on the smooth silver coating surface of the microwave part, and the secondary electron emission on the surface of the microwave part is restrained, so that the micro electro-discharge threshold value is improved, and the micro electro-discharge is restrained. The method mainly comprises that the microwave part is subjected to necessary cleaning, etching is conducted by using a Fe(NO3)3 solution, and the nano micro trap structure is formed on the smooth silver coating surface of the microwave part; and the part is immersed in 50% of hydrochloric acid to remove Fe3+. The method and an existing microwave part are in good connection, a secondary electron emission coefficient on the surface of the microwave part can be restrained obviously, and the micro electro-discharge threshold value of the part can be improved obviously.

Description

technical field [0001] The invention relates to a micro-etching process method for suppressing the micro-discharge effect of microwave components, and belongs to the technical field of surface treatment of microwave components. Background technique [0002] High-power microwave components in spacecraft payloads, such as output multiplexers, filters, switch matrices, and antenna feeds, are prone to micro-discharge effects. The micro-discharge effect is also called the secondary electron multiplication effect, which means that the component is at 1×10 -3 When the pressure is Pa or lower, the resonant discharge phenomenon occurs under the condition of high power. [0003] At present, most of the microwave components in the satellite payload system are based on aluminum alloy. In order to reduce the loss of components, the most commonly used method is surface electrochemical silver plating. In practical applications, these silver-plated components such as multiplexers and filt...

AI Technical Summary

Problems solved by technology

[0006] (1) The plasma bombardment method forms an irregular-shaped trap structure, and the depth of the trap is limited. If the plasma bombardment time is increased, not only the trap will not deepen, but the silver plating layer will be peeled off as a whole, which cannot inhibit the emission of secondary electrons. effect

[0007] (2) Physical coating and electrophoretic deposition require a certain amount of adhesion between the film and the substrate. Usually, it is necessary to increase the high-temperature annealing step to improve the adhesion between the film and the substrate. However, the aluminum alloy material is not resistant to high temperature, and the coating is The film on the surface of microwave components is easy to fall off

Images