Method and system for sand planting of diamond wire saw

Abstract

An embodiment of the invention discloses a method and a system for sand planting of a diamond wire saw. The method for sand planting of the diamond wire saw comprises the steps of 1) mixing diamond particles and a resin adhesive to form a uniform mixture; 2) coating the mixture uniformly on a surface of a core wire; and 3) curing the core wire. By the aid of the method for sand planting of the diamond wire saw, diamond particles can be uniformly distributed on the surface of the core wire, and simultaneously, the exposure rate of diamond particles can be controlled, so that the cutting precision and the cutting efficiency of the diamond wire saw can be guaranteed, and the service life of the diamond wire saw can be prolonged.

Description

technical field [0001] The invention relates to the technical field of semiconductor device manufacturing technology, and more specifically, to a diamond wire saw sand planting method and system. Background technique [0002] As a cutting tool with better cutting effect, diamond wire saw is favored because of its narrow kerf, high material yield, ability to cut large-sized workpieces, no ablation marks on the cutting surface, less environmental pollution, and high cutting precision. Widely used in the cutting of high-hardness materials, especially in the process of cutting crystalline silicon into silicon wafers. [0003] A common preparation method of diamond wire saw is the resin binder method, which is prepared by using a resin binder to bond diamond particles to the metal core wire by sand planting. The sand planting method determines the distribution uniformity, distribution density, and edge height (exposed rate of diamond particles) of diamond particles on the diamon...

AI Technical Summary

Problems solved by technology

Since the space of the box body 41 is relatively large compared to the diameter of the core wire, this determines that most of the diamond particles embedded in the resin layer on the surface of the core wire are embedded after multiple collisions with the inner wall of the box body 41 or the diamond particles. The resin layer, so the speed of the diamond particles when embedded in the resin layer is different, and because the collision process is random, this leads to uneven distribution of the diamond particles on the surface of the core wire, and also causes the embedding depth of the diamond particles to be different. Some even have insufficient adhesion due to the shallow embedding depth, and may fall off during the cutting process, thus affecting the cutting force, cutting accuracy, cutting efficiency and service life of the diamond wire saw.

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