Preparation method of high withstand voltage chip ceramic capacitor

Abstract

The invention provides a method for preparing a high voltage-resisting chip type ceramic capacitor and relates to the technical field of electronic information materials and elements. The method comprises the procedures of dispersing of ceramic slurry, curtain coating of ceramic membranes, printing of inner electrode, staggered lamination, uniform pressing, cutting, plastic removal, sintering, chamfering, end coating and silver electrode firing, wherein a solvent for the ceramic slurry adopts methylbenzene and ethanol, during printing of inner electrode, the inner electrode is made of a silver palladium alloy which is sintered at a low temperature, during end coating, the end electrode is made of silver (Ag), particularly, during dispersing of ceramic slurry, ceramic powder adopts Ba-Ti-Nd based ceramic powder, particle sizes of the Ba-Ti-Nd based ceramic powder are within a range of 0.22-0.95mu m of spherical or approximately spherical bodies, and the solvent for the ceramic slurry adopts a mixture of the methylbenzene and the ethanol in a proportion of (1-2.5):1. By the aid of the method for preparing the high voltage-resisting chip type ceramic capacitor, the high-frequency high voltage-resisting chip type ceramic capacitor can be manufactured effectively, and simultaneously, the manufacturing cost can be reduced effectively.

Description

technical field [0001] The invention relates to the technical field of electronic information materials and components, in particular to a preparation method of a high withstand voltage chip ceramic capacitor. Background technique [0002] As a new type of electronic components, multilayer ceramic capacitors (MLCC) are widely used in surface mount and plug-in installation. The main application industries are electrical appliances, automobiles, computers and other industrial and consumer industries. With the rapid development of electronic technology worldwide, the application of mounting technology is also advancing by leaps and bounds, and the demand for chip ceramic capacitors continues to rise. At present, some domestic manufacturers of high-voltage multilayer ceramic capacitors mostly use high-firing or medium-firing processes in the production of high-frequency ceramic capacitors, and use slurry with high palladium content as the inner electrode, which has high producti...

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Problems solved by technology

[0003] However, there are big deficiencies in high-firing or medium-firing ceramic capacitor technology, which are mainly manifested in: the use of higher palladium metal content, the shortcomings of high production costs are becoming more and more prominent, which is not conducive to the production and development of enterprises

In addition, most manufacturers use general floating screen patterns to make the internal electrodes of high withstand voltage ceramic capacitors, and the ultimate withstand voltage of the products is low

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