A flow-soldering spout choke device
A current blocking device and wave soldering technology, which is applied in the direction of tin feeding device, welding equipment, printed circuit assembly of electrical components, etc., can solve the problems of not being able to cut off the air, destroy the oxide film, and strong corrosion, and achieve disassembly and maintenance. Easy maintenance, reduced motor speed, and beneficial effects of recycling
Inactive Publication Date: 2015-08-19
XUZHOU HENGYUAN ELECTRICAL APPLIANCES
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- Description
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AI Technical Summary
Problems solved by technology
[0005] (1) The oxidation film will be destroyed due to the stirring of the tin by the motor at the nozzle, so that the purpose of blocking the air will not be achieved.
[0006] (2) This product is a chemical reagent, and the substances contained in it will destroy the structure of the solder in the furnace, causing tin pollution and hardening of tin slag.
[0007] (3) This product is highly corrosive, and it is easy to corrode the furnace material and motor impeller for long-term use
Method used
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Embodiment Construction
[0022] The present invention will be further described below in conjunction with accompanying drawing.
[0023] Such as figure 1 , figure 2 with image 3 As shown, the wave soldering nozzle choke device includes an upper baffle 1 and a lower baffle 2, the upper baffle 1 is provided with a mounting seat a3 and a protrusion 7, and the mounting seat a3 is located on the upper baffle 1 On the same side, they are respectively located at both ends of the upper baffle 1, and the mounting seat a3 at one end has an oblique hole 5, and the other end has a round hole 6; the lower baffle 2 is milled with a groove 8, and there is also a mounting Seat b4, said installation seat b4 is located on the same side of the lower baffle plate 2, is respectively located at the two ends of the lower baffle plate 2, and has round holes 6; as figure 1 As shown in the schematic diagram of the assembly structure, the upper baffle 1 and the lower baffle 2 are assembled into a telescopic structure throu...
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The invention discloses a flow choking device for a wave soldering nozzle, which comprises an upper baffle plate and a lower baffle plate, wherein mounting bases a and convex heads are arranged on the upper baffle plate; the mounting bases a are arranged on one side of the upper baffle plate, and are positioned at two ends of the upper baffle plate respectively; the mounting base a at one end is provided with an inclined hole, and the other end is provided with a round hole; the lower baffle plate is milled with recesses, and is provided with mounting bases b; the mounting bases b are arranged on one side of the lower baffle plate, are positioned at two ends of the lower baffle plate respectively, and are both provided with round holes; and the upper baffle plate and the lower baffle plate are assembled through the convex heads and the recesses to form a two-layer telescopic structure. The device uses no oxidization resistance reducing agent, and achieves effects capable of being realized by chemical reactions, through a physical method, so that the oxidization reaction is reduced, and the environment is protected; the contact area with oxygen is reduced so as to decrease oxidization of tin; and tin slag is not caked, so that convenience is brought for recycling, and the cost is effectively reduced; a tin spraying height can be increased to reduce the rotating speed of a motor, so that the oxidization of the tin and the abrasion of a hearth and a motor impeller are reduced; and the device is convenient to dismount and maintain.
Description
technical field [0001] The invention relates to a flow blocking device for a wave soldering nozzle, which belongs to the technical field of electronic processing and manufacturing. Background technique [0002] With the development of science and technology and the continuous improvement and improvement of mechanical automation technology, the electronic product processing industry is moving towards mechanical operation instead of manual labor. In the assembly process of PCBA (PCB empty board through SMT, and then through the whole process of DIP plug-in, referred to as PCBA process) wave soldering as a mainstream automatic welding configuration exists in various factories, the working principle of the welding part is to use a A set of parallel rails is used as the carrier to transport the PCB to be soldered. The way of electric heating is to heat the solder material to 265°C in the furnace to change it from solid to liquid tin, and then drive the impeller at the bottom of t...
Claims
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IPC IPC(8): B23K3/06H05K3/34
Inventor 魏礼理李洋
Owner XUZHOU HENGYUAN ELECTRICAL APPLIANCES