Composite adhesion agent

A composite adhesive, mass percentage technology, applied in adhesive types, polyether adhesives, adhesives, etc., can solve problems such as inability to bond wood, metal, plastic, inconvenient use, and poor slurry stability , to achieve high transparency, cost reduction and good stability

Inactive Publication Date: 2013-04-03
张亮
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the adhesives that can be used for the molding of ceramic products mainly include acrylic acid series and polyvinyl alcohol-based adhesives, but acrylic acid has a big disadvantage when used in electronic ceramic molding, that is, the stability of the slurry is poor; and polyvinyl alcohol-based adhesives The mixture has the disadvantages of poor slurry viscoelasticity and inconvenient use.
Moreover, the existing ceramic adhesives have relatively single uses and cannot bond wood, metal, and plastics.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0007] The present invention will be described in detail below through specific embodiments.

[0008] A kind of composite adhesive of the present invention is made up of following raw material according to mass percentage:

[0009] Polyvinyl acetate: 13%-15%, sodium silicate: 2%-5%, polyvinyl butyral: 10%-13%, polyethylene glycol-400: 1%-2%, phthalate Dibutyl formate: 5%-6%, isopropanol: 10%-14%, sodium aluminate: 6%-8%; methyl vinyl silicone rubber: 12%-16%, the balance is toluene, above The sum of the mass percentages of the components is 100%.

[0010] A large number of laboratory research experiments show that the present invention has good repeatability and stable performance, and provides a practical adhesive for forming electronic ceramics. Compared with similar adhesives in the prior art, the performance of the prepared adhesive has good stability, high transparency, high viscosity, and reduced cost. It can be used instead of other similar adhesives in the molding pr...

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PUM

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Abstract

The invention discloses a composite adhesion agent which comprises the components in percentage by mass as follows: 13%-15% of poly vinyl acetate, 2%-5% of sodium silicate, 10%-13% of polyvinyl butyral, 1%-2% of polyethylene glycol-400, 5%-6% of dibutyl phthalate, 10%-14% of isopropyl alcohol, 6%-8% of sodium aluminate, 12%-16% of methyl vinyl silicone rubber and the balance of methylbenzene, and the sum of the mass percentage of the components is 100%. The composite adhesion agent has the advantages of good stability, high transparency and high viscosity, lower the cost and can be used for adhesion of woods, metals and plastics.

Description

technical field [0001] The invention belongs to the technical field of adhesive materials and relates to a composite adhesive. Background technique [0002] In the molding of ceramics and their products, in order to improve the molding process and molding effect, it is often necessary to add binders, and most of the binders are discharged after the products are molded. All organic substances can be used as adhesives for ceramic molding after being dissolved and combined with additives. Stable, good transparency, beautiful appearance, suitable viscosity, and no adverse effect on the final performance of certain ceramic material products. At present, the adhesives that can be used for the molding of ceramic products mainly include acrylic acid series and polyvinyl alcohol-based adhesives, but acrylic acid has a big disadvantage when used in electronic ceramic molding, that is, the stability of the slurry is poor; and polyvinyl alcohol-based adhesives The mixture has the disa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J131/04C09J129/14C09J183/07C09J171/08
Inventor 张亮
Owner 张亮
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