Alumina micropowder production process

A technology of alumina micropowder and production process, applied in alumina/aluminum hydroxide, chemical instruments and methods, solid separation, etc., can solve silicon single crystal lattice damage, scratch silicon wafer, particle distribution cannot be changed at will, etc. problem, to achieve the effect of reasonable particle size distribution, random and appropriate proportion, and reducing surface scratches

Active Publication Date: 2013-04-10
无锡成旸科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The particle size distribution of domestic abrasives is relatively concentrated, and the particle distribution cannot be changed at will. During use, it is easy t

Method used

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Examples

Experimental program
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example

[0018] 1. Settlement process:

[0019] Put 1 part of crushed raw material into the sorting bucket for experiment, add 0.4 part of dispersion medium, add 0.1 part of dispersion medium when sorting 15#, the first stirring time (when working in each shift) is 5~45 min , the rest is 2~10min;

[0020] Process parameters:

[0021] Granularity number Settling time Siphon times 15# 12 ~15 minutes 6~12

[0022] Sorted product particle size distribution:

[0023] granularity: D0 D3 D50 D94 15# (μm) 18.4 15.2 10.45 6.94

[0024] The semi-finished product obtained after drying is one part, repeat the above process 10 times, and collect all 10 parts of the settled semi-finished product for use;

[0025] 2. Overflow process:

[0026] Put 1 part of the crushed raw material in the overflow cylinder for experimentation, add 0.04 parts of dispersion medium, because it is a 15# product, so the D3% is controlled at 16 μm;

[0027] Process p...

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Abstract

The invention provides an alumina micropowder production process, which can ensure that the grain size distribution of alumina micropowder can be self-designed and that particles with various grain sizes can be optionally proportioned and can remarkably reduce the surface scratches of silicon wafers in the process of lapping. The alumina micropowder production process includes the following steps: (1) using the sedimentation method to extract certain central alumina micropowder particles; (2) then using the overflow method to extract alumina micropowder particles at a certain stage. The alumina micropowder production process is characterized in that: the semifinished particles extracted in the two steps are mixed, the uniformly mixed particle mixture then undergoes overflow again, and therefore the final finished product is obtained.

Description

technical field [0001] The invention relates to a sorting process of alumina, in particular to a production process of alumina micropowder. Background technique [0002] The materials used for silicon wafer grinding in my country's semiconductor industry are basically imported from abroad. The quality of domestic abrasive materials has always been far behind that of foreign imports due to the craftsmanship. The particle size distribution of domestic abrasives is relatively concentrated, and the particle distribution cannot be changed at will. During use, it is easy to scratch the surface of the silicon wafer during the silicon wafer grinding and chip thinning process, resulting in lattice damage to the silicon single crystal. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies in the prior art, and to provide a production process for alumina micropowder, so that the particle size distribution of alumina micropowder can b...

Claims

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Application Information

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IPC IPC(8): B03B5/00C01F7/02
Inventor 虞向荣
Owner 无锡成旸科技股份有限公司
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