Alumina micropowder production process

Abstract

The invention provides an alumina micropowder production process, which can ensure that the grain size distribution of alumina micropowder can be self-designed and that particles with various grain sizes can be optionally proportioned and can remarkably reduce the surface scratches of silicon wafers in the process of lapping. The alumina micropowder production process includes the following steps: (1) using the sedimentation method to extract certain central alumina micropowder particles; (2) then using the overflow method to extract alumina micropowder particles at a certain stage. The alumina micropowder production process is characterized in that: the semifinished particles extracted in the two steps are mixed, the uniformly mixed particle mixture then undergoes overflow again, and therefore the final finished product is obtained.

Description

technical field [0001] The invention relates to a sorting process of alumina, in particular to a production process of alumina micropowder. Background technique [0002] The materials used for silicon wafer grinding in my country's semiconductor industry are basically imported from abroad. The quality of domestic abrasive materials has always been far behind that of foreign imports due to the craftsmanship. The particle size distribution of domestic abrasives is relatively concentrated, and the particle distribution cannot be changed at will. During use, it is easy to scratch the surface of the silicon wafer during the silicon wafer grinding and chip thinning process, resulting in lattice damage to the silicon single crystal. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies in the prior art, and to provide a production process for alumina micropowder, so that the particle size distribution of alumina micropowder can b...

AI Technical Summary

Problems solved by technology

The particle size distribution of domestic abrasives is relatively concentrated, and the particle distribution cannot be changed at will. During use, it is easy to scratch the surface of the silicon wafer during the silicon wafer grinding and chip thinning process, resulting in lattice damage to the silicon single crystal.