Printed circuit board and formation method thereof

Abstract

A printed circuit board comprises a substrate, wherein a first area and a second area are formed on the substrate, and the first area is arranged around the second area. A line is distributed at the first area, and a conductive area is formed at the second area. The line of the first area is electrically connected with the conductive area of the second area through wires, and the invention further provides a formation method of the printed circuit board. The line of the first area is electrically connected with the conductive area of the second area through the wires, and the second area is eliminated through adoption of a physical method so as to eliminate a short circuit. A method for eliminating the short circuit with the existing chemical process is replaced, and complexity of wire formation and wire elimination in the electroplating process is reduced. The electroplating process is simplified, process cost is reduced, technological process is simple, reliability of short circuit elimination is good, and efficiency is high.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a printed circuit board and a forming method thereof. Background technique [0002] With the continuous development of electronic products in the direction of multi-function, miniaturization, light weight, and high performance, the requirements for miniaturization and high density of printed circuit boards are also increasing. Wherein, the printed circuit board includes a substrate, a dielectric layer on the substrate and a conductive layer covering the surface of the dielectric layer. The conductive layer is a pre-designed circuit so that the chip is electrically connected to the printed circuit board. [0003] Forming circuits on the dielectric layer is an important step in the manufacturing process of printed circuit boards, including: providing a substrate on which a conductive layer is formed; laminating a dry film on the substrate; Expose the film; develop the expose...

AI Technical Summary

Problems solved by technology

Especially for leads of different lengths, the method of milling is more complicated

2) The leads are removed by exposure, development, and etching, but this method increases the process cost, and the process flow is complicated and the efficiency is low

However, the process of forming the lead wire and removing the lead wire is relatively complicated, which increases the process cost, and the process flow is complicated and the efficiency is low

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