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Heat-resistant and moisture-resistant low-melting-point lead-free solder alloy

A technology of lead-free solder alloy and lead-free solder, which is applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of solder joint surface oxidation corrosion, poor oxidation resistance, resistance change, etc., and achieve improvement Oxidation resistance, good wettability, crack reduction effect

Active Publication Date: 2015-05-27
马莒生
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the alloy has poor oxidation resistance under high temperature and high humidity conditions. When it is at 85°C85%RH (relative humidity) for 500 hours, there is no problem for 1000 hours. When it is more than 1000 hours, the surface of the solder joint is severely oxidized and corroded, reaching 2000 The surface crack can reach 220 μm after 1 hour, although it is better than the 2000-hour crack of Sn8Zn3Bi 394 μm, but the oxidation resistance of the alloy needs to be improved, and because zinc is easy to oxidize, hydrogen ions H will be generated under the action of water vapor + , H + Into the alloy, causing resistance changes and hydrogen-induced cracking problems

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The weight percentage of each chemical component in the lead-free solder alloy is: Zn: 10, Bi: 2.5, In: 1.5, P: 0.5, Zr: 0.001, and the remainder is Sn.

[0031] The melting point of the solder obtained in this example is 196°C, and the wetting angle θ is 32°. The surface crack depth of solder joints was 174 microns in 2000 hours at 85°C and 85%RH (relative humidity).

Embodiment 2

[0033] The weight percentage of each chemical component in the lead-free solder is: Zn: 12, Bi: 0.5, In: 5.0, P: 0.21, Zr: 0.1, B: 0.02, and the remainder is Sn.

[0034] The wetting angle θ of the obtained solder was 37.5°. The surface crack depth of solder joints was 185 microns in 2000 hours at 85°C and 85%RH (relative humidity).

Embodiment 3

[0036]The weight percentage of each chemical component in the lead-free solder is: Zn: 8, Bi: 4, In: 0.5, P: 0.1, Zr: 0.25, Mg: 0.02, and the remainder is Sn.

[0037] The wetting angle θ of the obtained solder was 37°. The surface crack depth of solder joints was 190 microns in 2000 hours at 85°C and 85%RH (relative humidity).

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PUM

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Abstract

A Pb-free solder alloy contains 4-12 wt% of Zn, 0.5-4 wt% of Bi, 0.5-5 wt% of In, 0.005-0.5 wt% of P, 0.001-0.5 wt% of Zr and at least one selected from a group consisting of: 0-0.1 wt% of Y, 0-0.2 wt% of Ge, 0-0.05 wt% of Mg, 0-0.02 wt% of B, 0-0.05 wt% of Al, 0-0.2 wt% of Ni and 0-0.3 wt% of Ag. And a balance of the Pb-free solder alloy is Sn.

Description

technical field [0001] The invention belongs to the technical field of electronic materials and electronic manufacturing, and particularly relates to a low melting point lead-free solder alloy resistant to high temperature and high humidity. Background technique [0002] The Sn-Pb eutectic alloy with a melting point of 183°C has been the main brazing material in the electronics industry for a long time, and has dominated the assembly of electronic components. Although the alloy has the characteristics of excellent wettability, weldability, electrical conductivity, mechanical properties, and low cost, due to the toxicity of Pb and Pb compounds, improper use will pollute the environment and damage the health of workers. The regulations are becoming more and more perfect and strict, and the decree prohibiting the use of lead-containing solder in the electronics industry is being implemented all over the world. Products, in 2004 to achieve comprehensive lead-free; Europe has ta...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
CPCB23K35/26C22C13/00B23K35/0222B23K35/0227B23K35/0244B23K35/025B23K35/24B23K35/262C22C13/02
Inventor 马莒生
Owner 马莒生