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Micro cone tower array heat exchanging plate and manufacture method thereof

A manufacturing method and heat exchange plate technology, applied in heat exchange equipment, lighting and heating equipment, electrical components, etc., can solve the complex shape, single internal shape of flow channel, heat transfer performance limitation of microchannel heat exchange plate, etc. problems, to achieve the effect of wide application fields, low equipment cost investment, and rich shapes

Inactive Publication Date: 2013-04-17
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] One of the objectives of the present invention is to propose a complex flow channel with excellent heat transfer performance in view of the shortcomings of the current microchannel heat exchange plate with a single internal shape of the flow channel and limited heat transfer performance of the microchannel heat exchange plate. Multi-height-scale microcone tower array heat exchange plate

Method used

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  • Micro cone tower array heat exchanging plate and manufacture method thereof
  • Micro cone tower array heat exchanging plate and manufacture method thereof
  • Micro cone tower array heat exchanging plate and manufacture method thereof

Examples

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Embodiment 1

[0050] Such as Figure 3 to Figure 5 As shown, taking a thin plate with a milling thickness of 0.17mm as an example, the number of directions of the "V" groove array on each surface of the thin plate is n 1 =3, the "V"-shaped grooves of the same array are parallel to each other, the "V"-shaped grooves of different arrays have an angle between each other, and the angle between two adjacent "V"-shaped groove arrays is θ=60°, "V" The angle between the two sides of the groove is 60° (that is, the slope of the "V" groove is 60°), the depth of the "V" groove is 0.087mm, and the distance between the two "V" grooves in the same array is 0.1mm. The angle between the two first direction arrays is α=90°, the offset of one direction array relative to the intersection point of the other two direction arrays is b=0.05mm, the substrate is a copper plate, and finally forms a regular triangular pyramid with two heights A heat exchange plate with a micro-pyramid tower array structure mixed wit...

Embodiment 2

[0057] Such as Figure 6 to Figure 8 As shown, taking the thin plate with a grinding thickness of 0.22mm as an example, the number of directions of the "V" groove array on each surface of the thin plate is n 1 =3, the "V"-shaped grooves of the same array are parallel to each other, the "V"-shaped grooves of different arrays have an angle between each other, and the angle between two adjacent "V"-shaped groove arrays is θ=60°, "V" The angle between the two sides of the groove is 90° (that is, the slope of the "V" groove is 45°), the depth of the "V" groove is 0.1mm, and the distance between the two "V" grooves in the same array is 0.2mm. The included angle of the array in the first direction is β=0°, the offset of the array in one direction relative to the intersection point of the array in the other two directions is c=0.05mm, and the substrate is an aluminum plate, finally forming a regular triangular pyramid with three heights and the like A heat exchange plate with a micro...

Embodiment 3

[0064] Such as Figure 9 to Figure 11 As shown, taking a thin plate with a milling thickness of 0.38mm as an example, the number of directions of the "V" groove array on each surface of the thin plate is n 1 =5, the "V" grooves of the same array are parallel to each other, the "V" grooves of different arrays have an angle between each other, and the angle between two adjacent "V" groove arrays is θ=36°, "V" The angle between the two sides of the groove is 90° (that is, the slope of the "V" groove is 45°), the depth of the "V" groove is 0.1mm, and the distance between the two "V" grooves in the same array is 0.2mm. The included angle between the first direction arrays is β=0°, the offsets of the five direction arrays relative to the center of the thin plate are all d=0.1mm, and the substrate is a copper plate, finally forming a pyramid with different heights and The utility model relates to a heat exchange plate with a microcone tower array structure mixed with cone-like circu...

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Abstract

The invention discloses a micro cone tower array heat exchanging plate and a manufacture method thereof and belongs to the field of heat dissipation. A multi-height micro cone tower array structure is respectively arranged on two sides of the heat exchanging plate. The structures are formed by mixing regular triangular pyramid linear arrays and regular hexagonal pyramid linear arrays with two heights or formed by mixing multi-height linear or circumference arrays of pyramids and conoids. A notch milling cutter with a V-shaped cutting tip or a diamond grinding wheel is used for milling or grinding a thin plate, a V-shaped groove array in the first direction is machined on one side of the thin plate during machining, then the thin plate rotates an angle theta sequentially to machine the rest V-shaped groove arrays respectively, and the other side of the thin plate is machined through the same method. By means of the heat exchanging plate, specific surface area of the thin plate can be increased, concave joints in V-shaped grooves are favorable for core forming, runners formed by the multi-height micro cone tower array structures are favorable for complicating a fluid flowing condition, and a heat transferring effect of the heat exchanging plate is improved.

Description

technical field [0001] The invention relates to heat exchange plate technology, which belongs to the field of heat dissipation, and in particular to a microcone tower array heat exchange plate and a manufacturing method thereof. Background technique [0002] With the development of technologies such as very large block integration (VLSI) circuits, electronic technology is developing rapidly in the direction of high speed, high power, and miniaturization. However, since the heat flux density per unit area of ​​microelectronic devices is getting higher and higher, and the high integration determines its small heat dissipation space, electronic technology is currently facing a major technical problem in the field of thermal control, which forces microelectronic devices to pay attention to heat dissipation technology put forward higher requirements. [0003] In 1981, Tuckerman and Pease in the United States first proposed the concept of "micro-groove radiator", which applied mi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28F3/04H01L23/367B23P15/26
Inventor 汤勇彭洁旻丁鑫锐陆龙生简漳智
Owner SOUTH CHINA UNIV OF TECH
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