Welding process of electronic component assembly

Abstract

The invention discloses a welding process of an electronic component assembly with a heat radiator. The process comprises the following steps of: carrying out surface treatment on welding parts of the heat radiator, a circuit board and an electronic component; putting the circuit board on the heat radiator and exposing embossments of the heat radiator outside holes of the circuit board; uniformly coating welding paste at the welding parts of the embossments of the heat radiator, the circuit board and the electronic component; respectively arranging the electrodes of the electronic component and heat radiating bodies on the electrode parts of the circuit board and the embossments of the heat radiator; and opening a welding box cover, putting the electronic component assembly with the electronic component, the circuit board and the heat radiator into a welding box, powering on to enable an electrical heating element to heat for warming, closing the box cover when the temperature of the heat radiator is approximate to a preset temperature, simultaneously heating the electronic component, the circuit board and the heat radiator to be at a welding temperature, smelting the welding paste at the welding part to accomplish once integral welding, and subsequently, carrying out cooling treatment on the electronic component assembly which is taken out of the welding box.

Description

technical field [0001] The invention relates to a welding process of electronic component assemblies, which is suitable for the welding of electronic component assemblies with radiators such as LED lighting lamps. Background technique [0002] The welding of high-power electronic components and components that require heat sinks, such as high-power LED lighting, must break through the bottleneck of small thermal conductivity and large thermal resistance of aluminum substrates and heat-conducting adhesives in order to achieve miniaturization and long life. Substrate and heat-conducting glue, directly solder the radiator (heat sink) of the LED with the electrothermal separation structure (that is, the separation structure of the heat dissipation part and the conductive part) to the protrusion (heat transfer part) of the radiator. [0003] Traditional electronic soldering processes include manual soldering, wave soldering and reflow soldering. Manual soldering and wave solder...

AI Technical Summary

Problems solved by technology

If the heat sink with large volume and high heat capacity is heated up in the reflow soldering machine together with high-power electronic components (such as high-power LED) and circuit boards, the high-power electronic components will not be able to withstand long-term high-temperature steaming and baking. Long-term steaming and baking will affect the lifespan, light efficiency, color temperature and other photoelectric parameters of electronic components (LEDs), and even damage them.

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