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curable resin composition

A technology of curable resin and composition, applied in nonlinear optics, photosensitive materials for opto-mechanical equipment, instruments, etc., can solve problems such as long drying time, and achieve the effect of short drying time

Active Publication Date: 2018-11-13
SUMITOMO CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Curable resin compositions proposed in the past may not be fully satisfactory due to long drying time when drying under reduced pressure after applying the curable resin composition to a substrate.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0260] Hereinafter, the present invention will be described in more detail using examples. Unless otherwise specified, "%" and "part" in an example are mass % and a mass part.

Synthetic example 1

[0262] Into a flask equipped with a reflux condenser, a dropping funnel, and a stirrer, nitrogen gas was flowed at 0.02 L / min to form a nitrogen atmosphere, 140 parts of diethylene glycol ethyl methyl ether was added, and heated to 70° C. while stirring. Next, a mixture of 40 parts of methacrylic acid and monomer (I-1) and monomer (II-1) {monomer (I-1) in the mixture: the molar ratio of monomer (II-1) = A solution obtained by dissolving 360 parts of 50:50} in 190 parts of diethylene glycol ethyl methyl ether was dropped into a flask kept at 70° C. over 4 hours using a drip pump.

[0263]

[0264] On the other hand, 30 parts of the polymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) was dissolved in 240 parts of diethylene glycol ethyl methyl ether over 5 hours using another drop pump. Parts of the resulting solution were added dropwise to the flask. After dropping the polymerization initiator solution, it was kept at 70° C. for 4 hours, and then cooled to room ...

Embodiment 1～5 and comparative example 1

[0276]

[0277] Each component shown in Table 1 was mixed at the ratio shown in Table 1 to obtain a curable resin composition.

[0278] [Table 1]

[0279]

[0280] In addition, in Table 1, the content part of resin (A) shows the mass part of solid content conversion.

[0281] Resin (A): Aa; Resin Aa

[0282] (Meth)acryloyl compound (B): dipentaerythritol hexaacrylate (KAYARAD (registered trademark) DPHA; manufactured by Nippon Kayaku Co., Ltd.)

[0283] Epoxy resin (C): bisphenol A epoxy resin (JER157S70; manufactured by Mitsubishi Chemical Corporation)

[0284] Polymerization initiator (D): Da; N-benzoyloxy-1-(4-phenylthiophenyl)octan-1-one-2-imine (IRGACURE (registered trademark) OXE 01; BASF Corporation system; O-acyl oxime compound)

[0285] Polymerization initiator (D): Db; 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole (B-CIM; Paul Tsuchiya Chemical Co., Ltd.; biimidazole compound)

[0286] Polymerization initiation aid (D1): 2-[2-oxo-2-(2-nap...

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Abstract

PURPOSE: A curing resin composition is provided to be possible to provide the short drying time at the vacuum drying. CONSTITUTION: A curable resin composition includes the curable resin and the solvent. The solvent comprises dialkyleneglycol dialkyl ether, a solvent-E1, and a solvent-E2 mentioned below. The content of the dialkyleneglycol dialkyl ether is over than 1 mass% and less than 45 mass% about the total amount of the solvent. The solvent-E1 is different with the dialkyleneglycol dialkyl ether and has the evaporation rate of over than 40 and less than 100 about the evaporation rate of 100 for the butyl acetate. The solvent-E2 is different with the dialkyleneglycol dialkyl ether and has the evaporation rate of over than 13 and less than 40 about the evaporation rate of 100 for the butyl acetate. The cured film is formed from the curable resin composition. The display device includes the cured film.

Description

technical field [0001] The present invention relates to a curable resin composition. Background technique [0002] In recent liquid crystal display panels and the like, curable resin compositions are used to form cured films such as photospacers and overcoats. As such a curable resin composition, a composition containing diethylene glycol ethyl methyl ether, 3-methoxy-1-butanol, and propylene glycol monomethyl ether as a solvent is known (JP2010-152335-A). [0003] The conventionally proposed curable resin composition may be unsatisfactory due to the long drying time when drying under reduced pressure after applying the curable resin composition to a substrate. Contents of the invention [0004] The present invention includes the following technical solutions. [0005] [1] A curable resin composition comprising a curable resin and a solvent containing dialkylene glycol dialkyl ether, solvent (E1) and solvent (E2), wherein two The content of the alkylene glycol dialkyl e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004
CPCC08L101/00G02F1/13G02F1/1303G03F7/004G03F7/0045G03F7/027G03F7/11
Inventor 白川政和
Owner SUMITOMO CHEM CO LTD