Laser processing device

Abstract

The present invention provides a laser processing device which has a parallelism adjustment function and can easily adjust the parallelism of laser light oscillated by a laser oscillator. The laser processing device has: a laser oscillator; a light concentrator; a beam diameter adjusting member disposed between the pulsed laser light oscillating member and the light concentrator; an optical path changing mirror that changes the optical path of the laser light toward the light concentrator The reflector positioning member, which positions the optical path conversion reflector at the active position and the non-active position; the imaging member, which detects the beam diameter of the laser light; the optical path length changing member, which changes the optical path length by moving the imaging member along the detection optical path; The control means controls the imaging means, the beam diameter adjustment means and the optical path length changing means, the control means positions the imaging means in two positions with different optical path lengths, makes the imaging means work to detect the beam diameter, and controls the beam diameter adjustment means to make the light beam The diameter becomes a predetermined relationship.

Description

technical field [0001] The present invention relates to a laser processing device having a parallelism adjustment function for making laser light oscillated and emitted by a laser oscillator particularly parallel light. Background technique [0002] In the manufacturing process of a semiconductor device, a plurality of regions are divided on the surface of a substantially disc-shaped semiconductor wafer by dividing lines called streets arranged in a grid pattern, and in the divided regions Form IC (Integrated Circuit: Integrated Circuit), LSI (LargeScale Integration: Large Scale Integrated Circuit) and other devices. Next, by cutting the semiconductor wafer along the lanes, the regions where the devices are formed are divided to manufacture individual semiconductor chips. Furthermore, an optical device wafer in which light-receiving elements such as light-emitting diodes or light-emitting elements such as laser diodes are stacked on the surface of a sapphire substrate is al...

AI Technical Summary

Problems solved by technology

[0006] However, the adjustment performed by the above-mentioned beam adjustment member is that the operator exposes the optical system, and positions the detector for detecting the beam diameter of the laser light at two positions on the optical path reaching the condenser to detect The beam adjustment member is adjusted so that the two beam diameters become equal, so there is a problem that the work efficiency is low

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