X-ray optical system of ball grid array (BGA) welding spot detector

Abstract

The invention discloses an X-ray optical system of a ball grid array (BGA) welding spot detector. The X-ray optical system comprises an X-ray generator, a to-be-tested BGS element, an X-ray conversion screen capable of converting X-ray into visible light, a camera lens for collecting visible light images converted by the X-ray conversion screen, an image signal amplifier, a lens system for carrying out convergence and stray light treatment on light signals output by the image signal amplifier, a charge coupled device (CCD camera, an image processor and an image displayer. The X-ray generator, the to-be-tested BGS element, the X-ray conversion screen, the camera lens, the image signal amplifier, the lens system and the CCD camera are sequentially arranged along a straight line, the image signal amplifier is connected with the camera lens, and the CCD camera, the image processor and the image displayer are sequentially connected. The X-ray optical system is simple in structure, reasonable in design, convenient to achieve, flexible and convenient to use, wide in using range, visual and vivid in display result, low in achievement cost, high in automation degree, high in detection efficiency and strong in practicability.

Description

technical field [0001] The invention relates to the technical field of BGA solder joint detection, in particular to an X-ray optical system of a BGA solder joint detector. Background technique [0002] With the development of science and technology, large-scale integrated circuits are widely used in all walks of life, and the welding components on the integrated circuit PCB board are chip-based and integrated, and the welding components are becoming more and more complex. Many PCB components are used The BGA packaging method has the advantages of small packaging area, many pins, powerful functions and low cost. But its shortcomings are also obvious, that is, the PCB board using BGA welding method is complicated and difficult to weld, and the chip is too small to observe. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide an X-ray optical system of a BGA solder joint detector, which has a simple structure, reasonabl...

AI Technical Summary

Problems solved by technology

But its shortcomings are also obvious, that is, the PCB board using BGA welding method is complicated and difficult to weld, and the chip is too small to be observed.

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