Method and structure of light emitting diode (LED) packaging
A technology of LED packaging and LED chips, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of low air tightness, affecting service life, aging of silica gel, etc., and achieve good air tightness, strong adhesion, The effect of improving stability and reliability
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[0019] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.
[0020] see figure 1 and figure 2 , figure 1 It is a flow chart of the LED packaging method of the present invention, figure 2 for figure 1 A schematic diagram of the LED structure 100 obtained by the method shown. like figure 1 As shown, the LED packaging method of the present invention mainly includes the following steps:
[0021] providing a stent 10 and forming a metal layer 12 on the stent 10;
[0022] providing a lens 30 and forming a metal layer 32 on the lens 30;
[0023] The lens 30 is mounted on the bracket 10 and the bracket 10 and the lens 30 are bonded by die bonding,...
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