Method for preparing Cu/MoCu/Cu three-layer composite plate blank

A technology of composite slab and composite plate, which is applied in chemical instruments and methods, layered products, metal layered products, etc., can solve the problems of high production cost, long preparation process, complicated procedures, etc., and achieves low processing cost, The effect of short process route and reduced residual porosity

Active Publication Date: 2015-01-14
西安宝德九土新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In summary, the traditional preparation process of Cu / MoCu / Cu composite materials is long, complicated and expensive.

Method used

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  • Method for preparing Cu/MoCu/Cu three-layer composite plate blank
  • Method for preparing Cu/MoCu/Cu three-layer composite plate blank
  • Method for preparing Cu/MoCu/Cu three-layer composite plate blank

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] The layer thickness ratio of the present embodiment Cu / MoCu / Cu three-layer composite slab is 1: 1: 1; The mass percent content of copper in the MoCu intermediate layer of the present embodiment Cu / MoCu / Cu three-layer composite slab is 30 %, and the balance is molybdenum.

[0032] to combine figure 1 , the preparation method of the present embodiment Cu / MoCu / Cu three-layer composite slab comprises the following steps:

[0033] Step 1, uniformly mixing molybdenum powder and copper powder to obtain molybdenum-based composite powder; the mass percentage of copper powder in the molybdenum-based composite powder is 1%, and the balance is molybdenum powder;

[0034] Step 2, using a hydraulic press to press the molybdenum-based composite powder described in step 1 into a molybdenum-based composite slab 1 with a length of 160mm, a width of 90mm, and a thickness of 7mm; the porosity of the molybdenum-based composite slab 1 is 30% ;

[0035] Step 3. Lay the molybdenum-based com...

Embodiment 2

[0038] The layer thickness ratio of the present embodiment Cu / MoCu / Cu three-layer composite slab is 1.5: 1: 1.5; The mass percent content of copper in the MoCu intermediate layer of the present embodiment Cu / MoCu / Cu three-layer composite slab is 20 %, and the balance is molybdenum.

[0039] combine figure 1 , the preparation method of the present embodiment Cu / MoCu / Cu three-layer composite slab comprises the following steps:

[0040] Step 1, uniformly mixing molybdenum powder and copper powder to obtain molybdenum-based composite powder; the mass percentage of copper powder in the molybdenum-based composite powder is 1%, and the balance is molybdenum powder;

[0041] Step 2, using a hydraulic press to press the molybdenum-based composite powder described in step 1 into a molybdenum-based composite slab 1 with a length of 200mm, a width of 100mm, and a thickness of 6mm; the porosity of the molybdenum-based composite slab 1 is 20% ;

[0042] Step 3. Lay the molybdenum-based com...

Embodiment 3

[0045] The layer thickness ratio of the present embodiment Cu / MoCu / Cu three-layer composite slab is 1: 2: 1; The mass percent content of copper in the MoCu intermediate layer of the present embodiment Cu / MoCu / Cu three-layer composite slab is 25 %, and the balance is molybdenum.

[0046] combine figure 1 , the preparation method of the present embodiment Cu / MoCu / Cu three-layer composite slab comprises the following steps:

[0047] Step 1, uniformly mixing molybdenum powder and copper powder to obtain molybdenum-based composite powder; the mass percentage of copper powder in the molybdenum-based composite powder is 1.5%, and the balance is molybdenum powder;

[0048] Step 2, using a hydraulic press to press the molybdenum-based composite powder described in step 1 into a molybdenum-based composite slab 1 with a length of 150mm, a width of 100mm, and a thickness of 10mm; the porosity of the molybdenum-based composite slab 1 is 25% ;

[0049] Step 3. Lay the molybdenum-based co...

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Abstract

The invention provides a method for preparing a Cu / MoCu / Cu three-layer composite plate blank. The method comprises the following steps of: I, evenly mixing molybdenum powder with copper powder to obtain molybdenum-based composite powder; II, pressing the molybdenum-based composite powder into a molybdenum-based composite plate blank by adopting an oil press; III, paving the molybdenum-based composite plate blank between two first copper plates to form a composite plate, then, putting the composite plate in a graphite crucible, and paving a second copper plate at the top part of the composite plate; and IV, performing infiltration under the protection of a hydrogen atmosphere, and performing surface coping treatment after furnace cooling to obtain the Cu / MoCu / Cu three-layer composite plate blank. The method for preparing the Cu / MoCu / Cu three-layer composite plate blank is short in process route and low in processing cost. An infiltration process and a composite process can be finished simultaneously, and therefore, the Cu / MoCu / Cu three-layer composite plate blank is prepared at one step. The Cu / MoCu / Cu three-layer composite plate blank prepared by adopting the method provided by the invention is strong in interface bonding force, low in residual porosity and easily controllable and adjustable in copper content, and is suitable for large-scale industrial production.

Description

technical field [0001] The invention belongs to the technical field of molybdenum-copper alloy composite materials, and in particular relates to a method for preparing a Cu / MoCu / Cu three-layer composite slab. Background technique [0002] Molybdenum-copper alloy is a two-phase mixed structure composed of molybdenum and copper, which neither solid dissolves nor forms intermetallic compounds, and is usually called a "pseudo-alloy". Molybdenum-copper alloy not only has the characteristics of high strength, high hardness and low expansion coefficient of molybdenum, but also has the characteristics of high plasticity and good electrical and thermal conductivity of copper. This unique comprehensive performance makes molybdenum copper alloy widely used, mainly in electrical contact materials, heat sink materials, aerospace high temperature materials, electronic packaging materials and other fields. [0003] Molybdenum copper alloy material has the properties of BeO, Al 2 o 3 The...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F7/04B32B15/01
Inventor 王国栋梁静李来平林小辉张新刘燕
Owner 西安宝德九土新材料有限公司
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