A needle-cone micro-nano double-level array structure material and its preparation method

A dual-level array and structural material technology, applied in the field of needle-cone micro-nano dual-level array structural materials and its preparation, can solve the problems of high manufacturing cost and complicated preparation process, and achieve low cost, high surface activity, and excellent functional properties Effect

Inactive Publication Date: 2016-07-06
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a needle-cone micro-nano dual-level array structure material to solve the technical problems in the prior art that the needle-cone size can only reach the micron scale, and the preparation process is relatively complicated and the manufacturing cost is high.
[0004] Another object of the present invention is to provide the method for preparing the above-mentioned needle-cone micro-nano dual-level array structure material, so as to solve the problem in the prior art that the needle-cone size can only reach the micron scale, and the preparation process is relatively complicated and the manufacturing cost is high. technical issues

Method used

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  • A needle-cone micro-nano double-level array structure material and its preparation method

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Effect test

Embodiment 1

[0034] The needle-cone micro-nano dual-level array structure material is prepared by using copper sheet as the metal substrate, and the steps are as follows.

[0035] (1) Degreasing, pickling, and activation treatment are performed on the surface of the copper sheet that needs hydrophobic treatment. That is, the copper sheet is electrolytically degreased for 60s, washed with distilled water, then pickled in 8% dilute hydrochloric acid for 25s, washed with distilled water, and then activated in 0.15g / L palladium chloride solution.

[0036] (2) Place the copper sheet treated in the step (1) in the electroplating solution, the copper sheet is used as the cathode, and the copper plate is used as the anode, and the copper sheet, the copper plate, the power supply and the electroplating solution are used to form a current loop through wires. The composition of the electroplating solution is: 0.1 mol / L of copper sulfate, 0.1 mol / L of triammonium citrate, 0.1 mol / L of boric acid, 1 pp...

Embodiment 2

[0041] The needle-cone micro-nano dual-level array structure material is prepared by using an aluminum sheet as a metal substrate, and the steps are as follows.

[0042] (1) Degreasing, pickling, and activation treatment are performed on the surface of the aluminum sheet that needs hydrophobic treatment. That is, the aluminum sheet is electrolytically degreased for 30 seconds, washed with distilled water, then pickled in 12% dilute hydrochloric acid for 15 seconds, washed with distilled water, and then activated in 0.25 g / L palladium chloride solution.

[0043](2) Place the aluminum sheet treated in step (1) in the electroplating solution, the aluminum sheet is used as the cathode, and the copper plate is used as the anode, and the aluminum sheet, the copper plate, the power supply and the electroplating solution are used to form a current loop through wires. The composition of the electroplating solution is: 0.12 mol / L of copper sulfate, 2 mol / L of sodium citrate, 1 mol / L of ...

Embodiment 3

[0048] The needle-cone micro-nano dual-level array structure material is prepared by using the iron sheet as the metal substrate, and the steps are as follows.

[0049] (1) Degreasing, pickling, and activation treatment are performed on the surface of the iron sheet that needs hydrophobic treatment. That is to say, the iron sheet is electrolytically degreased for 45s, washed with distilled water, then pickled in 10% dilute hydrochloric acid for 20s, washed with distilled water, and then activated in 0.2g / L palladium chloride solution.

[0050] (2) Place the iron sheet processed in step (1) in the electroplating solution, the iron sheet is used as the cathode, and the copper plate is used as the anode, and the iron sheet, the copper plate, the power supply and the electroplating solution are used to form a current loop through the wires. The composition of the electroplating solution is: 0.5 mol / L copper sulfate, 1 mol / L sodium citrate, 0.5 mol / L boric acid, 1000 ppm EDA, the t...

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Abstract

The invention relates to a new material and its preparation method, and especially relates to a conic micro-grade and nano-grade array structure material and its preparation method. The conic micro-grade and nano-grade array structure material comprises micro-grade cones and nano-grade cones, the micro-grade cones vertically grow on the surface of a metal substrate, the nano-grade cones grow on the surfaces of micro-grade cones, and the nano-grade cones are arrayed in a radial manner. Compared with the prior art, the preparation method allows the conic dimension of the conic micro-grade and nano-grade array structure material to reach the nanometer scale, has the advantages of simplicity, low cost, no special requirements on the shape and the material of the substrate, and is in favor of the wide application and the large-scale production of the material.

Description

technical field [0001] The invention relates to a new material and a preparation method thereof, in particular to a needle-cone micro-nano dual-level array structure material and a preparation method thereof. Background technique [0002] At present, the methods for preparing needle-cone crystal array materials mainly include photolithography (TanBJY, SowCH, KohTS, et al. Fabrication of size-tunable gold nanoparticles array with nanospherelithography, reactive ionetching, and thermal lannealing [J]. 模板法(CaoH,XuZ,SangH,eta1.Templatesynthesisandmagneticbehaviorofanarrayofcobaltnanowiresencapsulatedinpolyanilinenanotubules[J].AdvancedMaterials,2001,13(2):121—122.)、电子束、离子束加工(BaiA,HucC.Iron-cobahandiron-cobalt-nickelnanowiresdepositedbymeansofcyclicvohammetryandpulsereverseelectroplating[ J].ElectrochemicalCommunications.2003.5(1):78-82.) and other methods, but these methods are relatively complicated in technology, high in manufacturing cost, and the size of the needle cone can o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/00
Inventor 王红宾吴杰飞王宁黄本成杨超李明
Owner SHANGHAI JIAO TONG UNIV
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