Shallow concentration diffusion process for crystalline silicon solar cell
A technology of solar cells and diffusion processes, applied in circuits, electrical components, semiconductor devices, etc., can solve the problems of increasing reverse saturation current, shrinking P-N junction bandwidth, and reducing open circuit voltage, so as to increase the degree of harmony, improve Short-circuit current and efficiency improvement effect
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[0026] A shallow concentration diffusion process for crystalline silicon solar cells, the process comprising the following steps:
[0027] A, adopting the silicon wafer raw material whose conductivity type is P-type, preparing suede, cleaning and drying;
[0028] B. Oxidation: N at a flow rate of 8-10slm at a temperature of 780°C-785°C 2 and O of 3-5slm 2 , and put the cleaned silicon wafer into the diffusion tube for oxidation to obtain a 20-25nm thick oxide layer, that is, SiO 2 ;
[0029] C. Deposition: After the oxidation is completed, continue to feed N with a flow rate of 8-10slm 2 , 1.2-1.5slm O 2 And 0.5-0.6slm carries diffusion source-POCl 3 N 2 The mixed gas is used for P deposition, and the silicon wafer is mixed with O in the atmosphere at a temperature of 780-785°C 2 , POCl 3 A chemical reaction occurs to produce phosphorus, phosphorus pentachloride, phosphorus pentoxide, and chlorine gas. The time is 300-360s. The main reaction equation is as follows:
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