The invention discloses a method for manufacturing a PN-node by carrying out
double diffusion on a polysilicon
silicon chip. The method comprises a step S1 of constant-source
diffusion, a step S2 of heating limited-source
diffusion and a step S3 of constant-source
diffusion. In the invention, due to the step S3 of constant-source diffusion, the deposition of a
phosphorus impurity on the surface of the polysilicon
silicon chip is increased. Therefore, in the step S1, the
phosphorus impurity which is deposited in one step can be correspondingly reduced, so that the excessive deposition of the
phosphorus impurity is avoided. Moreover, the step S3 is carried out at a high temperature, and at the time, the
solid solubility of polysilicon on phosphorus atoms is improved, the deposited phosphorus impurity does not need to be propelled, the dissolved amount of the phosphorus impurity in polysilicon is controlled by controlling the deposition of the phosphorus impurity, and a dead zone generated due to excessive deposition and secondary propelling is avoided. According to the method for manufacturing the PN-node by carrying out the
double diffusion on the polysilicon
silicon chip, which is provided by the invention, the aim of solving the problem of a
dead layer on the surface, which is generated after the PN-node is manufactured by the polysilicon
silicon chip, can be fulfilled.