Delustrant composed of polyimide powder, polyimide film incorporating the delustrant, and manufacture thereof

Abstract

A polyimide film with low gloss comprising a polyimide base polymer constituting the film, and a polyimide powder distributed in the film, the polyimide film having a 60 DEG gloss value smaller or equal to about 50. The polyimide powder used as delustrant can have an average particle size between about 0.5 mum and about 15 mum. Embodiments described herein also include methods of preparing the polyimide film and the delustrant.

Description

technical field [0001] The invention relates to a polyimide powder, a polyimide film containing a matting agent and a preparation method thereof, in particular to a polyimide film with low gloss. Background technique [0002] Polyimide film is often used in electronic products. Due to the high flatness of the surface of polyimide film, the light reflection is high, which is easy to cause visual discomfort, and it is easy to make users' eyes tired when watching for a long time. Especially colored polyimide film, because the film is colored, the large amount of reflected light generated on the surface will be more visually significant. [0003] Therefore, in order to reduce the glossiness of the polyimide film, it has been reported to add a matting agent to the polyimide film to increase the roughness of the film surface to scatter the incident light. [0004] Materials known as matting agents can be classified into inorganic compounds and organic compounds. The inorganic co...

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Problems solved by technology

The inorganic compound includes silicon oxide, aluminum oxide, calcium carbonate, barium sulfate, titanium dioxide, etc., but because the inorganic particles have a higher dielectric constant, it may increase the dielectric constant of the polyimide film, thereby reducing the insulation of the film. resistance, which is not conducive to subsequent application

The organic compounds include polycarbonate (PC), polystyrene (PS), polymethyl methacrylate (PMMA), polyethylene, polypropylene, polyethylene terephthalate (PET), epoxy resin etc. However, in the preparation process of polyimide film, the chemical conversion temperature must usually exceed 250 ° C, but none of the organic compounds can withstand the temperature of 250 ° C or higher, if added to polyimide as a matting agent In the film, it can cause defects in the film, such as cracks or holes, or patches of inconsistent color due to uneven melting

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