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Light-emitting diode (LED) double-sided circuit board made by four wires

A circuit board, double-sided technology, applied in the direction of printed circuits and printed circuit components connected with non-printed electrical components, can solve the problems of high heat generation, high copper foil cost, high material cost, etc., and achieve practical work. The effect of life improvement, working length extension, and production cost reduction

Inactive Publication Date: 2013-06-19
田茂福
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, since resistance is inevitable when the LED circuit board is too long, it should not be too long in series, otherwise it will cause excessive voltage attenuation
[0005] Moreover, if the LED circuit board is too long, and there are too many series groups of LED lamps connected in parallel, the main lines on both sides of the circuit board need to load too much current, resulting in excessive heat generation. This heat, together with the heat of the LED lamp itself, is not easy to dissipate quickly. , causing the LED lamp to work at too high a temperature, which in turn affects the luminous performance and reliability of the LED lamp and its service life
[0006] For this reason, circuit boards of the prior art often adopt wider and thicker copper foil circuit layers, because the cost of copper foil is high, this will inevitably lead to higher material costs, and its final heat dissipation performance and work reliability not ideal
For example, in the actual application of this prior art LED circuit board, the total length after connection is generally not more than 5 meters, otherwise the voltage decays too much, it is difficult to ensure the normal operating voltage of all LED lamps, and the heat generation is too large and the heat dissipation The effect is not good, and it is difficult to apply in high-demand applications
[0007] Or, the circuit board of the prior art can also use soldering wires to enhance the conductive connection and improve the heat dissipation performance and work reliability of the circuit board. However, setting additional soldering wires requires additional processes and will make The structure of the circuit board is more complex and enlarged, which are all partial defects of the prior art

Method used

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  • Light-emitting diode (LED) double-sided circuit board made by four wires
  • Light-emitting diode (LED) double-sided circuit board made by four wires
  • Light-emitting diode (LED) double-sided circuit board made by four wires

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Embodiment Construction

[0050] The term "double-sided wiring board" means that the wiring is provided on both sides of the wiring board.

[0051] Before describing the present invention in detail, it should be understood by those skilled in the art that "element" should be understood in this application in the broadest sense, i.e., to include all types of electronic components, electrical components or other types of components used in circuits, For example, various resistors, various surface mount (SMT) type components, bracket type components, various high-power devices, etc., including high-power LEDs, and so on.

[0052] Furthermore, the terms "circuit board" and "circuit board" are used interchangeably in this application.

[0053] The manufacturing process and structure of the LED circuit board of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0054] Related materials of LED circuit board

[0055] The raw material...

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Abstract

The invention relates to a light-emitting diode (LED) double-sided circuit board made by four wires. The LED double-sided circuit board made by the four wires comprises a front line layer, a backside line layer, an insulation layer and a front side covering film, wherein the front line layer comprises a first line and a second line, the first line and the second line are separated along the vertical direction, and are directly made of a first metal wire and a second metal wire which are arranged in parallel. The backside line layer comprises a third line and a fourth line, wherein the third line and the fourth line are separated along the vertical direction and directly manufactured by a third metal wire and a fourth metal wire which are arranged in parallel. The insulation layer is arranged between the front line layer and the backside line layer. The front side covering film is covered on the front line layer, and multiple windows are arranged on the front side covering film. An interlayer conduction structure is arranged between the front line layer and the backside line layer and electrically communicated with the front line layer and the backside line layer which are arranged on the LED double-sided circuit board. The LED double-sided circuit board simplifies a product structure and manufacturing technology, reduces material costs and technical costs, lowers environmental pollutions and energy consumption, and improves product reliability and yield rate.

Description

technical field [0001] The invention relates to the field of LED circuit boards, in particular to an environmentally friendly LED double-sided circuit board made of four wires. Background technique [0002] In the prior art double-sided LED circuit board, the general LED circuit board product does not have another separate conductive main line, and the main line itself is the conductive circuit layer of the circuit board, generally copper foil. [0003] In practical applications, for this prior art LED circuit board, for example, about three LED lamps are generally connected in series to form a group, so that several LED lamp series groups are formed on the LED circuit board. Typically, the head and end of the circuit board product have positive and negative polarities (that is, set to positive and negative poles), and in practical applications, they can be directly connected end to end. [0004] However, since resistance is inevitable when the LED circuit board is too long...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/18
Inventor 田茂福
Owner 田茂福
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