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High temperature resisting epoxy resin curing agent for room temperature curing and preparation method thereof

An epoxy resin curing and room temperature curing technology, which is applied in the field of epoxy resin curing agents, can solve the problems of inability to guarantee the temperature resistance of engineering adhesives and the decrease in the strength of epoxy resin cured products, so as to avoid the risk of high temperature and high pressure synthesis, production The effect of simple method

Inactive Publication Date: 2013-06-26
HUBEI AOSHENG NEW MATERIAL TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Since the epoxy resin curing agent in the normal temperature curing system is modified according to the general method, the cured product can only withstand 50-60°C. When the ambient temperature rises above 60°C, the strength of the epoxy resin cured product decreases rapidly, which cannot guarantee engineering use. The need for glue temperature resistance

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  • High temperature resisting epoxy resin curing agent for room temperature curing and preparation method thereof

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Embodiment Construction

[0047] Below in conjunction with embodiment describe in detail:

[0048] 1. Additional components

[0049] The diluent is 1 to 3 of butyl glycidyl ether, dodecyl glycidyl ether, diethylene glycol, ethylene glycol and benzyl alcohol;

[0050] The catalyst is 1 to 3 of bisphenol A, phenol, DMP-30, organic acid, cresol and polyethylene polyamine;

[0051] The diepoxy compound is 1 to 3 kinds of ethylene glycol diglycidyl ether, butanediol diglycidyl ether, diglycidyl ether, low-viscosity epoxy resin and high-viscosity epoxy resin.

[0052] According to the requirements of the bonding field, the viscosity of this curing agent can be adjusted to 300-800mPa.s (25°C).

[0053] 2. Application examples

[0054] 1. Building and bridge reinforcement adhesive ratio (weight ratio)

[0055] CYD128 (bisphenol A epoxy resin) 80

[0056] F-51 (phenolic epoxy resin) 10

[0057] LS692 (reactive diluent) 10

[0058] Fumed silica (thickener) 1~3

[0059] This curing agent 35

[0060] Fill...

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Abstract

The invention discloses a high temperature resisting epoxy resin curing agent for room temperature curing and a preparation method thereof, and relates to an epoxy resin curing agent. The epoxy resin curing agent provided by the invention comprises main components in percentage by weight as follows: 55-60% of 4,4'-diaminodiphenyl-methane, 19-24% of polyphenyl polyamino methane and 20-25% of m-xylylenediamine, and comprises additional components in percentage by weight as follows: 5-10% of diluent, 1-10% of catalyst and 5-20% of diepoxide compound. The epoxy resin curing agent provided by the invention is synthesized by a normal temperature reaction, so that the risk of synthesis at high temperature and high pressure is avoided. The production method is simple; the composition is free from three wastes; the synthetic ratio is 100%; and no remarkable irritant gases are generated, so that the curing agent belongs to an environment-friendly product. The epoxy resin curing agent effectively satisfies the crying needs in bonding and sealing requiring markets in high temperature environmental building and bridge construction.

Description

technical field [0001] The invention relates to an epoxy resin curing agent, in particular to a room temperature curing and high temperature resistant epoxy resin curing agent and a preparation method thereof, which is suitable for epoxy resin curing agents requiring high temperature resistance in building and bridge construction. Background technique [0002] The invention of epoxy resin has gone through a long historical period. In 1947, the Devoe-Raynolds Company of the United States produced epoxy resin with industrial production value for the first time. Soon the Swiss Ciba company, the American Shell company and the De Chemical company all started the industrial production and application development of epoxy resin. The development of epoxy resin in my country began in 1956, and it was first successful in Shenyang and Shanghai. Industrial production began in Shanghai in 1958. After more than 40 years of struggle, the production and application of epoxy resin in my c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/50
Inventor 胡高平
Owner HUBEI AOSHENG NEW MATERIAL TECH
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