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Polyurethane modified epoxy resin adhesive and preparation method thereof

A technology of polyurethane modification and epoxy resin glue, which is applied in the direction of epoxy resin glue, polyurea/polyurethane adhesive, adhesive, etc., and can solve problems such as poor adhesion, unreasonable formula ratio, and failure to meet the use requirements. , to achieve the effect of simple process and good adhesion

Inactive Publication Date: 2013-06-26
GUANGDONG XINZHAN NEW CHEM MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In short, an adhesive is a substance that can bind adherends together through bonding; traditional adhesives have poor adhesion due to unreasonable formula ratios and cannot meet the needs of use.

Method used

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  • Polyurethane modified epoxy resin adhesive and preparation method thereof
  • Polyurethane modified epoxy resin adhesive and preparation method thereof
  • Polyurethane modified epoxy resin adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A polyurethane modified epoxy resin adhesive of the present invention consists of the following components in parts by weight:

[0028]

[0029] A, preparation of polyurethane modified epoxy resin

[0030] Heat 15 parts by weight of polyester polyol to 100°C for reflux dehydration, cool down to 40°C, add 4 parts by weight of diphenylmethane diisocyanate, heat to 65°C, react for 1 hour, cool to room temperature, add 0.5 parts by weight of 2 , 3 butanediol and 1 weight part of trimethylolpropane were stirred uniformly to obtain a polyurethane prepolymer, and 100 parts by weight of epoxy resin was added to the polyurethane prepolymer to react for 1 hour to obtain a polyurethane modified epoxy resin;

[0031] B. Preparation of fluorenyl epoxy resin

[0032] Add 10 parts by weight of bisphenol fluorene and 30 parts by weight of epichlorohydrin into the reaction kettle. Under the protection of nitrogen, heat up to 45°C. After fully dissolving, add 0.5 parts by weight of b...

Embodiment 2

[0036] A polyurethane modified epoxy resin adhesive of the present invention consists of the following components in parts by weight:

[0037]

[0038]

[0039] A, preparation of polyurethane modified epoxy resin

[0040] Heat 20 parts by weight of polyester polyol to 120°C for reflux dehydration, cool down to 60°C, add 7 parts by weight of diphenylmethane diisocyanate, heat to 80°C, react for 3 hours, cool to room temperature, add 2 parts by weight of 2 , 3 butanediol and 3 parts by weight of trimethylolpropane were stirred uniformly to obtain a polyurethane prepolymer, and 100 parts by weight of epoxy resin was added to the polyurethane prepolymer to react for 3 hours to obtain a polyurethane modified epoxy resin;

[0041] B. Preparation of fluorenyl epoxy resin

[0042] Add 20 parts by weight of bisphenol fluorene and 100 parts by weight of epichlorohydrin into the reaction kettle. Under the protection of nitrogen, heat up to 45°C. After fully dissolving, add 1.5 par...

Embodiment 3

[0046] A polyurethane modified epoxy resin adhesive of the present invention consists of the following components in parts by weight:

[0047]

[0048]

[0049] A, preparation of polyurethane modified epoxy resin

[0050] Heat 16 parts by weight of polyester polyol to 110°C for reflux dehydration, cool down to 50°C, add 5 parts by weight of diphenylmethane diisocyanate, heat to 70°C, react for 2 hours, cool to room temperature, add 1 part by weight of 2 , 3 butanediol and 2 parts by weight of trimethylolpropane were stirred uniformly to obtain a polyurethane prepolymer, and 100 parts by weight of epoxy resin was added to the polyurethane prepolymer to react for 2 hours to obtain a polyurethane modified epoxy resin;

[0051] B. Preparation of fluorenyl epoxy resin

[0052] Add 15 parts by weight of bisphenol fluorene and 50 parts by weight of epichlorohydrin into the reaction kettle, and raise the temperature to 45°C under the protection of nitrogen. After fully dissolvi...

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Abstract

The invention discloses a polyurethane modified epoxy resin adhesive and a preparation method thereof. The adhesive is prepared from the following components of 30-80 parts polyurethane modified epoxy resin, 20-60 parts of fluorene-based epoxy resin, 10-40 parts of carboxyl-polybutadiene acrylonitrile liquid rubber, 10-60 parts of curing agent, 1-8 parts of thixotropic agent, 0.5-3 parts of compound accelerator and 2-6 parts of coupling agent. The preparation method comprises the steps of weighing each component according to the ratio, evenly mixing the polyurethane modified epoxy resin, the fluorene-based epoxy resin and the carboxyl-polybutadiene acrylonitrile liquid rubber under agitation at 50-70 DEG C; adding the curing agent, the thixotropic agent and the coupling agent and heating to 70-90 DEG C; evenly agitating, and cooling to room temperature after vacuum defoaming; and adding the compound accelerator under agitation at 40-50 DEG C until evenly mixing. The polyurethane modified epoxy resin adhesive disclosed by the invention is good in adhesion and simple in process, and can be used for materials such as buildings, metal, glass, plastic ceramic, and the like.

Description

technical field [0001] The invention relates to a polyurethane modified epoxy resin adhesive; the invention also relates to a method for preparing the silicone modified epoxy resin sealant. Background technique [0002] Adhesive refers to a kind of natural or synthetic, organic or inorganic substances that can connect two or more parts or materials together through the adhesion and cohesion of the interface, collectively referred to as glue. Adhesives, also known as adhesives, are customarily referred to as glue. In short, an adhesive is a substance that can bind adherends together through bonding; traditional adhesives have poor adhesion due to unreasonable formula ratios and cannot meet the needs of use. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a silicone-modified epoxy resin sealant with a reasonable proportion and high bonding strength; [0004] Another object of the present i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/06C09J163/00C08G18/58C08G59/06C08G59/50
Inventor 黄活阳
Owner GUANGDONG XINZHAN NEW CHEM MATERIAL
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