Method for detecting tin content in tin-lead solder by utilizing lead acetate chelatometric back-titration method

Abstract

The invention discloses a method for detecting the tin content in tin-lead solder by utilizing a lead acetate chelatometric back-titration method. The method comprises the steps of acquiring parameters through the lead acetate chelatometric back-titration method by utilizing a prepared standard tin solution, and calculating the titer T of acetate lead to tin by utilizing a formula; acquiring parameters through the lead acetate chelatometric back-titration method by utilizing a prepared to-be-tested tin-lead solder sample solution; and finally calculating the tin content (Sn%) in the tin-lead solder through a formula. the specific method for acquiring parameters through the lead acetate chelatometric back-titration method comprises the steps of preparing a standard or to-be-tested sample solution for the tin-lead solder, taking the solution separately, adding a potassium nitrate solution and an EDTA ethylene diamine tetraacetic acid solution, heating and boiling, and cooling through running water; adding a hexamethylenetetramine solution, adding xylenol orange, titrating by using the standard acetate lead solution until the solution presents an orange red color, adding ammonium fluoride, laying aside, titrating again by using the standard acetate lead solution, recording the consumed milliliter number of the standard acetate lead solution during titration; and taking the parameters acquired in the method in an equation to obtain the final detection result.

Description

technical field [0001] The invention relates to an analysis and test technology, which relates to an analysis method for measuring the tin content in tin-lead solder with 30% to 80% by applying the lead acetate chelate trans titration method. Background technique [0002] With the development of analysis and testing technology at home and abroad, various testing companies have correspondingly improved the analysis and testing level of their products in order to adapt to the fierce competition in the market. At present, the analysis method of tin-lead solder in my country is carried out in accordance with the national standard GB / T10574.1-2003 , the analysis method is iodine titration, but the sample analysis process is complicated, time-consuming, and consumes more reagents and glassware. [0003] In the chemical analysis method of tin-lead solder, due to the high content of tin, iodine titration is generally used. The key to the determination of tin by this method is to ens...

AI Technical Summary

Problems solved by technology

On the one hand, they can partially reduce the reduced tin in the titration, resulting in a positive error; on the other hand, a relatively large amount of powdered elemental state substances in the solution can cause tin co-precipitation and cause a negative error.

When measuring tin in tin-lead solder, the reduction of divalent tin must be carried out under the condition of isolating the air, which is inconvenient to operate

In the process of reducing agent selection and reduction time control, it is very easy to cause inaccurate measurement results, thus affecting the authenticity of measurement data

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