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Positive photosensitive resin composition, photosensitive resin layer and display device using same

A resin composition, positive photosensitive technology, applied in photosensitive materials for opto-mechanical equipment, nonlinear optics, optics, etc., can solve the problem of difficult to achieve high aperture ratio, low heat resistance and insulation performance, insulation resistance performance deterioration, etc.

Active Publication Date: 2016-01-20
CHEIL IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One of the attempts is to form a black filter layer (filterlayer) between colored patterns, but it has the problem of being difficult to achieve a high aperture ratio and bringing low heat resistance and insulating properties
Then, another attempt was made to secure a high aperture ratio and improve contrast and brightness at the same time by making the non-light-emitting region black, but had a problem of deteriorating the intrinsic properties of the insulating layer because the colorant was dissolved in a large amount
In addition, inorganic pigments used in black paints, colorants, such as carbon black, etc., generally have excellent light-shielding properties, but have a problem of deteriorating insulation resistance, which is not suitable for insulating layers of organic light-emitting diodes
On the other hand, organic pigments are relatively composed of pigment mixtures to achieve black color and thus have better insulation resistance than inorganic pigments, but need to be included in the photosensitive resin composition to achieve equivalent light-shielding properties and are more likely degrade pattern developability and generate residue

Method used

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  • Positive photosensitive resin composition, photosensitive resin layer and display device using same
  • Positive photosensitive resin composition, photosensitive resin layer and display device using same
  • Positive photosensitive resin composition, photosensitive resin layer and display device using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0299] Synthesis Example 1: Synthesis of Polybenzoxazole Precursor (PBO-A)

[0300]In a four-necked flask equipped with a stirrer, a temperature control device, a nitrogen injector, and a condenser, 41.1 g of 2,6-bis[[[5-[1-(amino-4-hydroxyphenyl)-2 , 2,2-trifluoro-1-(trifluoromethyl)ethyl]-2-hydroxyphenyl]amino]methyl]-4-cresol dissolved in 280g of N-methyl-2-pyrrolidone (NMP ), while passing nitrogen gas. When the solid was completely dissolved, 9.9 g of pyridine was added to the solution. The mixture was kept at a temperature range of 0 to 5°C, and slowly added thereto in 30 minutes in a dropwise manner by dissolving 13.3 g of 4,4'-oxydibenzoyl chloride in 142 g of N-methyl The solution prepared in base-2-pyrrolidone (NMP). The resulting mixture was reacted at 0°C to 5°C to room temperature for 1 hour and then its temperature was raised to room temperature, followed by stirring for 1 hour to complete the reaction.

[0301] Here, 1.6 g of 5-norbornene-2,3-dicarboxylic ...

Embodiment 2

[0316] The positive photosensitive resin composition was prepared according to the same procedure as in Example 1, except that 8 parts by weight of the red dye CFR007 represented by Chemical Formula 29 and 2 parts by weight of the azo-based orange color represented by Chemical Formula 30 were added. Dye CFO011.

Embodiment 3

[0318] The positive photosensitive resin composition was prepared according to the same procedure as in Example 1, except that 16 parts by weight of the red dye CFR007 represented by Chemical Formula 29 and 4 parts by weight of the azo-based orange represented by Chemical Formula 30 were added. Dye CFO011.

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PUM

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Abstract

The invention provides a positive photosensitive resin composition, a photosensitive resin layer and a display device using the same. The composition includes (A) alkali-soluble resin selected from polybenzoxazole precursor, polyimide precursor, and combinations thereof, (B) photosensitive diazoquinone compound, (C) phenol compound, (D) At least one organic dye having an absorption wavelength of 400 nm to 700 nm, and (E) a solvent containing 1 to 40 parts by weight of the organic dye (D) based on 100 parts by weight of the alkali-soluble resin (A).

Description

[0001] related application [0002] This application claims priority and benefit to Korean Patent Application No. 10-2011-0147388 filed in the Korean Intellectual Property Office on December 30, 2011, the entire contents of which are incorporated herein by reference. technical field [0003] The present disclosure relates to a positive photosensitive resin composition (positive photosensitive resin composition), a photosensitive resin layer (photosensitive resin layer) and a display device using the same. Background technique [0004] Conventional surface protection layers and interlayer insulating layers for semiconductor devices include polyimide resins having excellent heat resistance, electrical properties, mechanical properties, and the like. Polyimide resins have recently been used as easy-to-coat photosensitive polyimide precursor compositions. The photosensitive polyimide precursor composition is coated on a semiconductor device, patterned by ultraviolet (UV) rays, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/039G03F7/016G02F1/13
CPCG03F7/0233G03F7/0757G03F7/105G03F7/039G03F7/022
Inventor 权志伦姜真熙金大润金上权金相均金尚洙卢健培尹银卿李种和李俊昊李珍泳田桓承赵显龙洪忠范黄银夏
Owner CHEIL IND INC