A kind of glass cloth reinforced PTFE material high-frequency plate hole-making electroplating method
A technology of holey electroplating and high-frequency board, which is applied in the direction of multilayer circuit manufacturing and electrical connection formation of printed components, etc., to achieve the effect of avoiding nodulation
Active Publication Date: 2016-02-10
JIANGNAN INST OF COMPUTING TECH
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Problems solved by technology
[0007] The technical problem to be solved by the present invention is to provide a glass cloth that can avoid the nodulation phenomenon on the hole wall after electroplating and the reliability problem of the printed circuit board due to poor copper sinking on the hole wall in view of the above-mentioned defects in the prior art. Reinforced PTFE material high-frequency plate hole electroplating method
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[0027] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings.
[0028] In the present invention, in order to improve the problem of copper plating nodules caused by the residual glass cloth on the hole wall, a glass etchant can be used to dissolve the remaining glass cloth on the hole wall, and activate the PTFE material on the hole wall, and then perform hole-forming electroplating Made of copper, so as to avoid the problem of nodulation on the hole wall during the electroplating process of printed circuit boards containing PTFE materials, and improve the effect of sinking copper on the hole walls of PTFE materials.
[0029] Among them, the glass etchant is a solvent that can dissolve glass fibers, and its main component is ammonium bifluoride (NH 4 HF 2 ).
[0030] The following will refer to figure 1 T...
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The invention provides a high-frequency board-holed plating method of a glass cloth reinforced PTFE (Poly Tetra Fluoro Ethylene) material. The method comprises the following steps of: during the treatment of a reduction conditioning agent in which a glass etching agent is added, adding the glass etching agent into the reduction conditioning agent and thus forming a mixed solution; and treating the hole wall of the whole structure of a multilayer printed circuit board by using the mixed solution. According to the method, the problems of the printed circuit board containing the PTFE material that nodules are formed in the holes and copper is poorly plated on the hole wall are solved. After the plasma treatment on the printed circuit board is carried out, the glass etching agent is added into the reduction conditioning agent, so that the glass etching agent can be used for activating the PTFE material on the hole wall while being used for dissolving and etching the glass cloth remaining on the hole wall. Therefore, the nodules formed on the hole wall are avoided; and the integrity of the copper plated on the hole wall is ensured.
Description
technical field [0001] The invention relates to the field of printed circuit board manufacturing, and more specifically, the invention relates to a hole-forming electroplating method for a glass cloth reinforced PTFE material high-frequency board. Background technique [0002] In order to meet the electrical interconnection between different layers of printed circuit boards and the installation requirements of electronic components, it is necessary to remove the remaining glass fiber and other materials on the hole wall when drilling the printed circuit board to ensure that the hole wall is smooth, and then through The electroless copper deposition method deposits a thin layer of chemical copper on the board surface and the hole wall, and finally thickens the copper on the surface of the printed circuit board and the hole wall by electroplating. The hole after electroplating not only requires the thickness of the hole copper and the integrity of the hole copper coverage to m...
Claims
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IPC IPC(8): H05K3/42H05K3/46
Inventor 王改革吴小龙吴梅珠徐杰栋刘秋华胡广群梁少文李成虎
Owner JIANGNAN INST OF COMPUTING TECH