Diamond abrasive and electroplated diamond tool

A diamond and abrasive technology, applied in the field of diamond abrasives and electroplating diamond tools, can solve problems such as affecting cutting ability, diamond abrasive falling off, diamond abrasive clumping, etc., and achieve the effect of improving operation accuracy and reducing the probability of falling off.

Inactive Publication Date: 2013-07-24
SIGMA INNOVATION TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method cannot effectively fix the diamond abrasive on the surface of the grinding tool, so it is very likely to cause the diamond abrasive to fall off during the grinding process. If it occurs in the CMP process, it will cause scratches on the wafer; If the abrasive falls off, the thickness of the electroplating layer must be increased to increase the coating degree of the coating on the diamond abrasive, which will reduce the height of the diamond abrasive exposed to the coating and

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  • Diamond abrasive and electroplated diamond tool
  • Diamond abrasive and electroplated diamond tool
  • Diamond abrasive and electroplated diamond tool

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[0034] The present invention is to provide a kind of diamond abrasive, after its surface is modified, the surface of the diamond abrasive has micro-conductivity, so that in the process of the diamond abrasive being electroplated and attached to the surface of the tool, the electroplated metal can grow along the surface of the diamond abrasive, improving The adhesion of diamond abrasives to the tool surface while maintaining the surface precision of the diamond tool.

[0035] The present invention provides a kind of surface modification mode of diamond abrasive, and its steps are as follows:

[0036] Step 1: If figure 1 , providing diamond abrasives 11 . In this specific embodiment, the diamond abrasive 11 is a natural diamond particle or an artificial diamond particle of a micron (micro) level or a nanometer (nano) level, but it is not limited thereto. Preferably, the average particle size of the selected diamond abrasive 11 is The diameter ranges from about 1 micrometer (μm...

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Abstract

The invention relates to a diamond abrasive and an electroplated diamond tool. Through a film coating mode, the surface of the diamond abrasive is modified, a conducting layer is covered on the surface of the diamond abrasive, wherein, a metal component with composition gradient enables the surface of the diamond abrasive to have micro conductivity, and the conducting layer has increasing electric conductivity along the external direction of the surface of the diamond abrasive, so that an electroplated layer can more effectively coat the diamond abrasive while electroplating for increasing the adhesive force of the diamond abrasive and a tool base.

Description

technical field [0001] The invention relates to a diamond abrasive, in particular to a diamond abrasive and an electroplated diamond tool with micro-conductivity. Background technique [0002] At present, diamond tools are widely used in 3C manufacturing industry, traditional manufacturing industry, aviation titanium industry or general grinding fields, such as metal cutting, workpiece grinding or mirror polishing; and these diamond grinding tools are mostly through Manufactured by electroplating. [0003] With the development of science and technology, precision diamond abrasive grinding tools are widely used in high-tech industries, such as the polishing pad conditioner (Pad Conditioner) used in chemical mechanical polishing (CMP) in the semiconductor technology industry , that is to fix and combine the diamond abrasive on a metal substrate. In addition to the known brazing method, the bonding method also uses electroplating. If the surface of the diamond abrasive can hav...

Claims

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Application Information

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IPC IPC(8): C09K3/14C25D15/00
Inventor 陈文东何主亮
Owner SIGMA INNOVATION TECH
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