Ultra-thin high-density multilayer circuit chip front-mount packaging structure and manufacturing method

Abstract

The invention relates to an ultra-thin high-density multi-layer circuit chip front packaging structure and a manufacturing method of the packaging structure. The structure comprises first-layer circuit layers (9), a chip (2) and second-layer circuit layers (1), wherein the front of each second-layer circuit layer (1) is provided with an inner pin (8), the chip (2) is packed on the front face of the middle second-layer circuit layer (1), the periphery of the chip (2), the periphery of the second-layer circuit layers (1) and the periphery of metal wires (10) are packed with molding compound (3), the second-layer circuit layers (1) are connected with the first-layer circuit layers (9) through copper column layers (4), the back face of each first-layer circuit layer (9) is provided with an outer pin (6), and the back face of each outer pin (6) is provided with a metal ball (7). The structure and the method have the advantages that the thickness of a chip package substrate is reduced, ultra-thin high-density packaging is achieved, the reliability level is improved, a high-density circuit technique ability is truly achieved, and the warping problem of a traditional substrate in a packaging process can be completely solved.

Description

technical field [0001] The invention relates to an ultra-thin high-density multilayer circuit chip front-mount packaging structure and a manufacturing method, belonging to the technical field of semiconductor packaging. Background technique [0002] The current high-density substrate packaging structure such as Figure 32 As shown, the manufacturing process is mainly to form a multi-layer circuit board by stacking the core material of the glass fiber board by accumulating materials. The holes between the circuit layers are opened by laser drilling, and then the holes are plated to complete the electrical circuit board. connect. [0003] The above-mentioned high-density substrate packaging structure has the following deficiencies and defects: [0004] 1. There is an extra layer of glass fiber material, and also the cost of an extra layer of glass fiber; [0005] 2. Because there is an extra layer of glass fiber board core layer, the thickness is about 100~150μm, so it is im...

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Problems solved by technology

[0005] 2. Because there is an extra layer of glass fiber board core layer, the thickness is about 100~150μm, so it is impossible to achieve ultra-thin packaging design;

[0006] 3. Glass fiber itself is a kind of foaming material, so it is easy to absorb moisture and moisture due to the storage time and environment, which directly affects the safety capability or reliability level of reliability;

[0007] 4. The connection between the circuit layers is made by laser drilling, and then copper plating is carried out. The aperture formed by laser drilling is large, and it is difficult to achieve high-density design and manufacture.

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