Method for electron beam composite instant liquid phase diffusion bonding of GH4169 high-temperature alloy
A technology of GH4169 and high-temperature alloys, applied in welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as liquefaction cracks and low tensile strength of joints
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specific Embodiment approach 1
[0012] Specific implementation mode 1: In this implementation mode, the method for connecting GH4169 superalloy by electron beam composite transient liquid phase diffusion is implemented according to the following steps:
[0013] 1. Use sandpaper to polish the surface to be welded of the GH4169 superalloy specimen, and clean the GH4169 superalloy specimen with acetone or absolute ethanol to obtain the cleaned GH4169 superalloy specimen; 2. Put the middle layer on the cleaned The GH4169 high temperature alloy test piece is placed between the surfaces to be welded, and then placed in a vacuum diffusion connection furnace, and the GH4169 high temperature alloy test piece is assembled with a pressure of 0.05 to 15 MPa, and the vacuum degree in the vacuum diffusion connection furnace reaches 5.0×10 -3 Start heating at Pa, and perform initial connection at a connection temperature of 1050-1150°C, stop heating after 20-120 minutes of connection, and cool to room temperature with the f...
specific Embodiment approach 2
[0015] Specific embodiment two: the difference between this embodiment and specific embodiment one is that step one uses 80#, 180#, 400#, 600#, 800#, 1000# metallographic sandpaper successively to treat the surface to be welded of the GH4169 superalloy test piece Sand smooth. Other steps and parameters are the same as those in Embodiment 1.
specific Embodiment approach 3
[0016] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that in step 2, the initial connection is performed at a connection temperature of 1080-1120° C., and the heating is stopped after 60-90 minutes of connection. Other steps and parameters are the same as those in Embodiment 1 or Embodiment 2.
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