Rigid-flex combined circuit board and manufacturing method therefore

A soft-rigid combination and production method technology, applied in printed circuit components, secondary processing of printed circuits, structural connection of printed circuits, etc., can solve problems such as incompatibility, torn flexible circuit boards, abnormal inner layers

Active Publication Date: 2013-09-04
XIAMEN HONGXIN ELECTRON TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0032] 1. Rigid copper clad laminates 8 and 9 are both double-sided copper foils. To make the outer hard board of this soft-rigid circuit board, only one side of copper is needed, and one side of the copper needs to be etched away, which wastes one side of copper and increases the process. high cost
[0033] 2. The flexible area 15 of the soft-rigid board is protected by rigid filler boards 10 and 11, and there will be gaps between it and the rigid copper-clad laminate. Inaccurate, during the production process, especially when going through the DES line, copper plating and other wet processes, the liquid medicine will penetrate into the flexible circuit board in the flexible area 15, causing abnormalities in the inner layer, especially the flexible circuit board in the flexible area 15. There are pads on the circuit board, and the pads may be etched when passing th

Method used

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  • Rigid-flex combined circuit board and manufacturing method therefore
  • Rigid-flex combined circuit board and manufacturing method therefore
  • Rigid-flex combined circuit board and manufacturing method therefore

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Embodiment Construction

[0077] Such as Figure 5 As shown, the present invention discloses a rigid-flex circuit board, which includes a rigid area 180 and a flexible area 190 connected to the rigid area 180; wherein the rigid area 180 includes a first prepreg 10 at the center, which is sequentially laminated on the first First flexible copper clad laminates 20, 30, cover films 40, 50, second prepregs 60, 70, rigid substrates 80, 90, third prepregs 100, 110 and second flexible copper clad laminates 120, 130 on the upper and lower surfaces of the prepreg 10; The flexible area 190 includes the first flexible copper-clad laminates 20, 30 extending from the rigid area 180 and the covering films 40, 50 on their outer surfaces; on the rigid area 180, the via hole 181 required by the electrical properties of the product is drilled, and in addition Solder resist layers 140 and 150 are further provided on the upper and lower surfaces of the rigid region 180 .

[0078] Such as Figure 4 to Figure 6 As shown, ...

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PUM

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Abstract

The invention discloses a rigid-flex combined circuit board and a manufacturing method of the rigid-flex combined circuit board. The rigid-flex combined circuit board is made of flexible copper clad laminates, rigid substrates, covering film, prepregs and rigid filling boards. One part of the flexible copper clad laminates are used as flexible boards, and the other part of the flexible copper clad laminates are combined with the rigid substrates through the prepregs to be used as outer-layer rigid boards; the inner-layer flexible copper clad laminates and the prepregs of the rigid substrates are bonded, the prepregs of an inner-layer flexible circuit board are bonded, holes are drilled on the rigid substrates, and flexible areas are punched and cut; boards with the same sizes of the flexible areas are milled out of the filling boards; the inner-layer flexible circuit boards are combined to from a whole through the prepregs bonding the inner-layer flexible circuit boards and are laminated and solidified, each prepreg combines the inner-layer flexible circuit boards, the rigid substrates, the filling boards and the outer-layer flexible copper clad laminates to form a whole to be laminated and solidified, follow-up processing is conducted, laser cutting is conducted on the flexible areas of the outer-layer flexible copper clad laminates, appearance processing, filling board removing and other conventional process production are conducted, and therefore manufacture of the rigid-flex combined circuit board is finished.

Description

technical field [0001] The invention relates to a rigid-flex combined circuit board and a manufacturing method thereof, in particular to a rigid-flex combined circuit board with a rigid outer layer. Background technique [0002] With the development of electronic science and technology, more and more electronic products are becoming "light, thin, and portable". A certain mechanical strength must also have a certain softness requirement. Rigid-flex circuit boards, also known as rigid-flex circuit boards, refer to printed circuit boards containing one or more rigid regions and one or more flexible regions, which have the flatness, mechanical strength and The flexibility and flexibility of flexible circuit boards. Rigid-flex circuit boards can connect circuits located on different planes, which is very conducive to the utilization of space, and is especially suitable for applications in precision electronics such as portable electronic products. [0003] At present, the comm...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/14H05K3/28H05K3/36
Inventor 陈妙芳
Owner XIAMEN HONGXIN ELECTRON TECH
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