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How to make metamaterials

A manufacturing method and metamaterial technology, applied in the field of metamaterials, can solve problems such as inability to cover copper on material substrates, and achieve the effects of small shrinkage, no volatilization, and fast curing speed

Active Publication Date: 2017-04-19
KUANG CHI CUTTING EDGE TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the above-mentioned thermoplastic material substrate cannot be coated with copper by using the hot pressing process.

Method used

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  • How to make metamaterials
  • How to make metamaterials
  • How to make metamaterials

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Embodiment Construction

[0021] The purpose of the present invention is to provide a method for manufacturing metamaterials, which is used for copper cladding process on substrates that are transparent to ultraviolet light, such as organic resin substrates that are transparent to ultraviolet light. Organic resin substrates include: polycarbonate substrates, polycarbonate substrates, Vinyl, polypropylene, polystyrene or polyethylene terephthalate backing. Hereinafter, the technical solution of the present invention will be described in detail by taking the polyethylene terephthalate substrate as an example.

[0022] See figure 2 , figure 2 is a schematic structural diagram of the metamaterial according to the first embodiment of the present invention. Such as figure 2 As shown, the metamaterial 20 disclosed in the present invention includes: a metamaterial substrate 21 and a metal microstructure 22 . Wherein, the metal microstructure 22 is disposed on the metamaterial substrate 21 .

[0023] se...

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Abstract

The invention discloses a method for manufacturing a metamaterial. The metamaterial comprises a metamaterial substrate and a metal microstructure arranged on the metamaterial substrate. The method for manufacturing the metamaterial comprises the following steps that the substrate allowing ultraviolet light to penetrate through is provided, ultraviolet light polymerization glue is selected, the ultraviolet light polymerization glue is stuck on the upper surface of the substrate by means of a sheet gluing machine, metal foil is rolled on the upper surface, with the ultraviolet light polymerization glue, of the substrate, ultraviolet light is emitted to the lower surface, covered with metal foil, of the substrate by means of an ultraviolet light polymerization machine and the ultraviolet light polymerization glue is solidified to obtain the metamaterial substrate, and the metal foil is etched to form the metal microstructure. The method for manufacturing the metamaterial has the advantages that copper cladding can be carried out on the substrate which has thermoplasticity and allows the ultraviolet light to penetrate through, in addition, due to the fact that the ultraviolet light polymerization glue can be solidified at room temperature, the solidifying speed is high, the shrinking percentage is small, and volatilization is avoided, the production efficiency can be greatly improved and the manufacturing cost can be greatly reduced.

Description

technical field [0001] The invention relates to the technical field of supermaterials, in particular to a method for manufacturing supermaterials. Background technique [0002] Light, as a kind of electromagnetic wave, when it passes through glass, because the wavelength of light is much larger than the size of atoms, we can use the overall parameters of the glass, such as the refractive index, rather than the detailed parameters of the atoms that make up the glass to describe The response of glass to light. Correspondingly, when studying the response of materials to other electromagnetic waves, the response of any structure in the material whose scale is much smaller than the wavelength of the electromagnetic wave to electromagnetic waves can also be described by the overall parameters of the material, such as the dielectric constant ε and magnetic permeability μ. By designing the structure of each point of the material, the dielectric constant and magnetic permeability of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q15/00
Inventor 刘若鹏季春霖岳玉涛黄新政
Owner KUANG CHI CUTTING EDGE TECH LTD