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Mesoporous silica particles, method for producing mesoporous silica particles, and mesoporous silica particle-containing molded article

A silicon dioxide and silicon dioxide source technology, applied in chemical instruments and methods, inorganic chemistry, transportation and packaging, etc., can solve problems such as low thermal conductivity, low dielectric constant, mesopore shape and irregular arrangement, etc. Achieve the effect of high strength and low dielectric constant

Active Publication Date: 2013-09-11
PANASONIC CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this method, the shape and arrangement of the mesopores are irregular, and the strength of the molded article may be reduced for reasons involving the strength of the particles
Meanwhile, the matrix material may penetrate into the mesopores through the enlargement of the mesopores, and may not acquire features such as low refractive index (low n), low dielectric constant (low k), and low thermal conductivity

Method used

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  • Mesoporous silica particles, method for producing mesoporous silica particles, and mesoporous silica particle-containing molded article
  • Mesoporous silica particles, method for producing mesoporous silica particles, and mesoporous silica particle-containing molded article
  • Mesoporous silica particles, method for producing mesoporous silica particles, and mesoporous silica particle-containing molded article

Examples

Experimental program
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Effect test

preparation example Construction

[0054] [Preparation of Mesoporous Silica Particles]

[0055] The method for producing mesoporous silica particles of the present invention is not particularly limited, but the method preferably includes the following steps. The first step is a "surfactant composite silica particle preparation step" for preparing surfactant composite silica particles having mesopores in which surfactant micelles containing additives containing hydrophobic moieties exist as templates. The next step is a "silica covering step" in which a silica source is added to the surfactant-composite silica particles, thereby covering the surface (periphery) of the silica particles (silica core) with silica. The final step is a "removal step" of removing the surfactant and the hydrophobic part-containing additive contained in the obtained surfactant-composite silica particles.

[0056] In the step of preparing surfactant composite silica particles, a liquid mixture comprising the following items is first pre...

Embodiment 1

[0114] Synthesis of Surfactant Composite Silica Particles:

[0115] In a separable flask equipped with a condenser, stirrer and thermometer, 120 g of H 2 O, 6.4 g of 25% NH 3 Aqueous solution, 20g of ethylene glycol, 1.20g of cetyltrimethylammonium bromide (CTAB), 1.54g of 1,3,5-trimethylbenzene (TMB) (TMB / CTAB molar ratio=4), 1.29 g of tetraethoxysilane (TEOS) and 0.23 g of γ-aminopropyltriethoxysilane (APTES) were mixed and stirred at 60° C. for 4 hours to prepare surfactant composite silica particles.

[0116] Formation of silica-covered sections:

[0117] To the reaction solution of the surfactant-composite silica particles, 1.29 g of TEOS and 0.23 g of APTES were added and stirred for 2 hours.

[0118] Extraction of template and preparation of isopropanol dispersion:

[0119] To a mixture of 30 g of isopropanol, 60 g of 5N-HCl, and 26 g of hexamethyldisiloxane mixed and stirred at 72° C., the synthesis reaction solution containing the surfactant-composite silica parti...

Embodiment 2

[0123] Surfactant composite silica particles were synthesized in the same manner as in Example 1. To the reaction solution of surfactant-composite silica particles, 8.4 g of CTAB was added and stirred at 60° C. for 10 minutes, and then 1.29 g of TEOS and 0.23 g of APTES were added thereto and stirred for 2 hours to form carbon dioxide Silicon covered parts. The template was extracted under the same conditions as in Example 1 and an isopropanol dispersion was prepared.

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Abstract

Provided are mesoporous silica particles imparting both greater strength to a molded article as well as low reflectance (Low-n), low dielectric constant (Low-k), low thermal conductivity, and other functions. The mesoporous silica particles have a particle interior provided with first mesopores and a particle exterior periphery covered with silica. Preferably, second mesopores, smaller than the first mesopores, are provided in the silica-covered part formed by the silica covering. Steps, including a surfactant complex silica particle preparation step for mixing a surfactant, water, alkali, a hydrophobic part-containing additive provided with a hydrophobic part for increasing the volume of a micelle formed by the surfactant, and a silica source to prepare surfactant complex silica particles, and a silica covering step for adding the silica source to the surfactant complex silica particles and covering the particle outer periphery with silica, are used to produce the mesoporous silica particles. Penetration of a matrix material into the mesopores can be suppressed.

Description

technical field [0001] The present invention relates to mesoporous silica particles, a process for the preparation of mesoporous silica particles and molded articles obtained using mesoporous silica particles. Background technique [0002] Conventionally, silica particles having a hollow structure such as those shown in Patent Document 1 are known to be particles that provide a low refractive index (low n) and a low dielectric constant (low k). Recently, there is a need for a larger void ratio in order to obtain higher performance. However, it is difficult to reduce the thickness of the shell in hollow silica particles, and if the particle size is reduced below 100 nm, the void ratio may decrease due to structural reasons. [0003] In these cases, since the void ratio of the mesoporous silica particles does not tend to decrease for structural reasons as the particle size decreases, they are promising as applications in low refractive index (low n), low dielectric constant (...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B37/00
CPCC01B37/00C08K3/36Y10T428/2993H10K50/858C08K9/10
Inventor 福冈步矢部裕城大久保达也下岛敦石井大贵
Owner PANASONIC CORP