High-density integrated micro-nano photoelectron chip radiator based on thermoelectric cooler

Abstract

The invention provides a high-density integrated micro-nano photoelectron chip radiator based on a thermoelectric cooler, and aims at solving the cooling problem of chip integration components by using thermoelectric material and a Stirling generator to structure a physical device capable of recycling energy. The device comprises the Stirling generator, the thermoelectric cooler and a power supply module; the thermoelectric cooler is arranged at the top of a chip; the cold end of the thermoelectric cooler is in contact with the upper surface of the chip; the hot end of the thermoelectric cooler is in contact with a hot cavity of the Stirling generator; the power supply module is respectively and parallelly connected with the Stirling generator and the thermoelectric cooler through circuits; and the power supply module comprises a battery and a control circuit. The device provided by the invention utilizes the thermoelectric cooler to cool the chip integration components so as to ensure the stability for the normal work of the chip integration components; and as the heat energy produced by the chip integration components is utilized to be converted into electric energy for supplying electricity to the cooler, the purpose of cooling is realized. The device saves energy and protects environment, is efficient, and has a good cooling effect and lower noise.

Description

technical field [0001] The invention relates to a heat dissipation device for high-density integrated micro-nano optoelectronic chip integrated components, especially a cooling device using a micro-thermoelectric cooler and a Stirling generator, which is suitable for high-power chips and high-density integrated micro-chips in electronic equipment. Cooling of integrated components of nano-optoelectronic chips. Background technique [0002] With the rapid development of microelectronic devices, the number of internal components of the device has increased geometrically, and the problem of heat dissipation has become more prominent. Commonly used heat dissipation devices include: air cooling, water cooling, heat pipes, and multiple ways of combined heat dissipation. Air-cooled heat dissipation is forced cooling by fans, and the radiator increases the surface area of ​​heat dissipation to achieve the effect of air cooling. With the continuous increase of heat dissipation power, ...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to use a thermoelectric cooler to propose a thermoelectric integrated micro-nano optoelectronic chip heat dissipation device to overcome the problems of heat dissipation energy consumption and high noise of the heat dissipation device in the prior art, and to provide an energy-saving, stable operation, Chip cooling device with good heat dissipation effect

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